LFE2-70E-6F672I

The LFE2-70E-6F672I is an ECP2 family field programmable gate array (FPGA) from Lattice Semiconductor Corporation. It combines a high logic capacity and on-chip memory with a large I/O count in a compact surface-mount package, designed for industrial-grade embedded applications.

With 68,000 logic elements, approximately 1.06 Mbits of embedded memory and up to 500 I/O, this device targets designs that require dense programmable logic, substantial local RAM, and broad external interfacing while operating over an extended temperature range.

Key Features

• Core Logic 68,000 logic elements provide substantial programmable resource for complex combinational and sequential logic implementations.
• Embedded Memory Approximately 1.06 Mbits of on-chip RAM (1,056,768 bits) for buffering, state storage and local data processing.
• I/O Capacity Up to 500 general-purpose I/O pins to support extensive connectivity and multiple peripheral interfaces.
• Power Core supply voltage range of 1.14 V to 1.26 V to match system power domains and enable predictable power planning.
• Package & Mounting 672-BBGA package (supplier device package 672-FPBGA (27×27)), surface-mount for compact board-level integration.
• Industrial Grade & Temperature Industrial-grade device rated for operation from -40 °C to 100 °C for extended-temperature deployments.
• Environmental Compliance RoHS compliant.

Typical Applications

• High-density I/O systems — Leverage the 500 I/O pins to integrate multiple sensors, peripherals and interfaces on a single FPGA.
• Memory-intensive embedded logic — Approximately 1.06 Mbits of embedded memory supports local buffering, FIFOs and state storage without immediate need for external RAM.
• Industrial control and monitoring — Industrial grade construction and -40 °C to 100 °C operating range make the device suitable for extended-temperature industrial deployments.
• Space-constrained board designs — 672-BBGA (672-FPBGA (27×27)) surface-mount package supports compact PCB layouts where board area is limited.

Unique Advantages

• High logic capacity: 68,000 logic elements enable large-scale programmable designs and complex state machines without partitioning across multiple devices.
• Substantial on-chip RAM: Approximately 1.06 Mbits of embedded memory reduces reliance on external memory and simplifies BOM and board routing.
• Extensive I/O integration: 500 I/O pins support broad peripheral and bus connectivity, minimizing the need for external multiplexing logic.
• Industrial temperature rating: Rated from -40 °C to 100 °C to meet the environmental needs of demanding embedded and industrial applications.
• Compact BGA package: 672-BBGA (672-FPBGA (27×27)) surface-mount package enables high-pin-count deployment in compact footprints.
• Controlled core voltage: 1.14 V to 1.26 V core supply range supports stable power planning across system designs.

Why Choose LFE2-70E-6F672I?

The LFE2-70E-6F672I delivers a balance of large programmable logic resources, meaningful on-chip memory and high I/O density in a compact, industrial-grade package. It is suited for designers who need to consolidate complex logic, buffering and multiple interfaces into a single FPGA while meeting extended-temperature requirements.

This device is appropriate for engineering teams focused on scalable embedded designs that require predictable power characteristics, broad connectivity and RoHS compliance, providing a reliable platform for a range of industrial and high-density applications.

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