LFE2-70E-6F900C

The LFE2-70E-6F900C is an ECP2 family Field Programmable Gate Array (FPGA) offered in a 900-ball BGA package. It provides a programmable fabric with 68,000 logic elements and approximately 1.06 Mbits of on-chip RAM for customizable digital designs.

With a high I/O count and a compact surface-mount 900-FPBGA (31×31) package, this commercial-grade device targets designs that require substantial logic capacity, significant embedded memory, and dense I/O integration while operating within standard commercial temperature and voltage ranges.

Key Features

• Programmable Logic Capacity — 68,000 logic elements to implement complex custom logic, state machines, and data processing functions.
• Embedded Memory — Approximately 1.06 Mbits of on-chip RAM for buffering, lookup tables, and intermediate storage within the FPGA fabric.
• High I/O Count — 583 I/O pins to support broad peripheral connectivity and dense interface requirements.
• Package and Mounting — Available in a 900-BBGA / 900-FPBGA (31×31) surface-mount package for compact board designs.
• Power Supply — Operates from a core supply range of 1.14 V to 1.26 V to match platform power designs.
• Operating Conditions — Commercial-grade device rated for 0 °C to 85 °C operation.
• RoHS Compliance — Device is RoHS-compliant for regulatory and environmental considerations.

Typical Applications

• Custom I/O Interfaces — High I/O count enables implementation of complex interface bridging and peripheral aggregation on a single device.
• Embedded Logic and Control — 68,000 logic elements support medium-to-large custom control systems and state-machine implementations.
• On-chip Data Buffering — Approximately 1.06 Mbits of embedded RAM can be used for packet buffering, FIFOs, and temporary data stores within streaming or packet-based designs.

Unique Advantages

• High Logic Density: 68,000 logic elements provide capacity for substantial custom logic integration, reducing the need for multiple discrete devices.
• Large I/O Fabric: 583 I/Os support multiple interfaces and parallel peripheral connections without external IO expanders.
• Embedded Memory: Approximately 1.06 Mbits of on-chip RAM minimizes external memory requirements for many buffering and storage tasks.
• Compact Packaging: 900-BBGA / 900-FPBGA (31×31) package enables dense PCB layouts while maintaining surface-mount assembly compatibility.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation for standard commercial applications.
• Regulatory Compliance: RoHS-compliant construction supports environmental and compliance objectives.

Why Choose LFE2-70E-6F900C?

The LFE2-70E-6F900C balances substantial logic capacity, meaningful on-chip memory, and a very high I/O count in a compact 900-ball BGA package. It is positioned for designers who need a programmable, high-density solution for complex digital designs within commercial temperature and voltage envelopes.

This device is well-suited for teams seeking to consolidate multiple functions into a single FPGA, reduce board-level component count, and leverage on-chip resources for buffering and interface logic. Its RoHS compliance and standard package options support integration into modern manufacturing flows.

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