LFE2-70E-5FN900C

The LFE2-70E-5FN900C is an ECP2 family Field Programmable Gate Array (FPGA) offered in a 900‑BBGA package. It provides a high-density logic fabric with 68,000 logic elements, substantial on-chip memory, and a large I/O count for compact, commercial embedded designs.

Designed for commercial applications, this device supports systems that require dense logic integration, significant embedded RAM, and broad I/O connectivity while operating within a 1.14 V to 1.26 V core supply range and a 0 °C to 85 °C temperature window.

Key Features

• Logic Capacity  68,000 logic elements to implement complex custom logic, state machines, and glue logic in a single device.
• Embedded Memory  Approximately 1.06 Mbits of embedded memory (1,056,768 total RAM bits) for buffering, FIFO, and state storage requirements.
• I/O Density  Up to 583 I/O pins to support extensive peripheral interfacing and high-pin-count designs.
• Power  Core voltage range of 1.14 V to 1.26 V to match system power architectures and maintain stable core operation.
• Package and Mounting  900‑BBGA (supplier package: 900‑FPBGA, 31×31) in a surface-mount form factor for space-constrained PCBs.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for a wide range of commercial embedded environments.
• RoHS Compliant  Meets RoHS requirements for lead-free assembly and environmental compliance.

Typical Applications

• Commercial Embedded Systems  Implement custom control logic, protocol handling, or system glue in compact designs requiring high logic and I/O density.
• High‑Density I/O Control  Manage large arrays of sensors, ports, or interfaces using the device’s 583 I/O pins and programmable logic.
• Memory‑Intensive Logic  Use the on-chip embedded memory for buffering, queues, and state machines in data-path and control applications.
• Integration and Prototyping  Consolidate multiple discrete functions into a single FPGA for board-level integration and rapid design iteration.

Unique Advantages

• High Logic Density: 68,000 logic elements enable consolidation of complex functions and reduce the need for multiple discrete devices.
• Substantial On‑Chip Memory: Approximately 1.06 Mbits of embedded RAM reduces external memory requirements and simplifies PCB routing.
• Extensive I/O Count: 583 I/O pins provide flexibility for connecting numerous peripherals and high-pin-count interfaces without external multiplexing.
• Compact, Surface‑Mount Package: The 900‑BBGA (900‑FPBGA, 31×31) package offers a small footprint for space-constrained system designs.
• Commercial Temperature Compatibility: Rated 0 °C to 85 °C for reliable operation across typical commercial environments.
• RoHS Compliance: Supports lead-free manufacturing and environmental compliance goals.

Why Choose LFE2-70E-5FN900C?

The LFE2-70E-5FN900C combines a high logic element count, significant embedded memory, and a large I/O complement in a compact 900‑BBGA surface-mount package, making it well suited for commercial embedded designs that demand integration and flexibility. Its defined operating voltage range and commercial temperature rating provide predictable behavior in standard system environments.

This device is appropriate for engineers and system designers seeking to reduce board-level component count, consolidate functions into a single FPGA, and leverage on-chip memory and I/O density for cleaner system architectures and simplified BOMs.

Request a quote or submit an inquiry to receive pricing and availability information for the LFE2-70E-5FN900C.