LFE2-70E-5FN672I

IC FPGA 500 I/O 672FPBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 500 1056768 68000 672-BBGA

Quantity 254 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package672-FPBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGANumber of I/O500Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8500Number of Logic Elements/Cells68000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1056768

Overview of LFE2-70E-5FN672I – ECP2 Field Programmable Gate Array (FPGA) IC 500 1056768 68000 672-BBGA

The LFE2-70E-5FN672I is an ECP2 family Field Programmable Gate Array from Lattice Semiconductor Corporation designed for industrial applications. It combines substantial on-chip logic, embedded memory, and high I/O density in a compact ball-grid array package.

This device targets designs that require up to 68,000 logic elements, approximately 1.06 Mbits of embedded memory, and up to 500 I/Os, while operating across an industrial temperature range and a narrow core voltage window for stable power delivery.

Key Features

  • Core Logic — Provides 68,000 logic elements for implementing custom digital functions and complex logic networks.
  • Embedded Memory — Approximately 1.06 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
  • I/O Density — Up to 500 I/O pins to interface with a wide range of external peripherals and subsystems.
  • Power — Operates from a core voltage supply range of 1.14 V to 1.26 V to match tight power rails in many FPGA-based systems.
  • Package & Mounting — Supplied in a 672-BBGA package (supplier device package: 672-FPBGA, 27×27) for surface-mount PCB assembly and compact board integration.
  • Temperature & Grade — Industrial grade device rated for operation from −40°C to 100°C, suitable for demanding environments.
  • Environmental Compliance — RoHS compliant to support regulatory and manufacturing requirements.

Unique Advantages

  • High logic capacity: 68,000 logic elements enable large-scale programmable implementations without external logic expansion.
  • Substantial on-chip memory: Approximately 1.06 Mbits of embedded RAM reduces dependence on external memory for many designs.
  • Extensive I/O availability: Up to 500 I/Os simplify connectivity to sensors, transceivers, and other system interfaces.
  • Industrial temperature range: Rated from −40°C to 100°C to maintain operation in wide-ranging environments.
  • Compact BGA footprint: The 672-ball FPBGA (27×27) package enables high-density PCB implementations while supporting surface-mount assembly.
  • RoHS compliant: Facilitates adherence to environmental and manufacturing standards.

Why Choose LFE2-70E-5FN672I?

The LFE2-70E-5FN672I is positioned for engineers and procurement teams seeking an industrial-grade FPGA with a balance of high logic capacity, embedded memory, and extensive I/O in a compact BGA package. Its defined core voltage range and wide operating temperature make it suitable for designs that require predictable power characteristics and reliable operation across challenging environments.

Choose this device when you need scalable programmable logic resources, on-chip memory to reduce external BOM, and a dense I/O complement—delivered in a surface-mount, RoHS-compliant package suitable for industrial applications.

Request a quote or submit an inquiry to receive pricing and availability for the LFE2-70E-5FN672I.

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