LFE2-70E-5FN672I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 500 1056768 68000 672-BBGA |
|---|---|
| Quantity | 254 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 500 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8500 | Number of Logic Elements/Cells | 68000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1056768 |
Overview of LFE2-70E-5FN672I – ECP2 Field Programmable Gate Array (FPGA) IC 500 1056768 68000 672-BBGA
The LFE2-70E-5FN672I is an ECP2 family Field Programmable Gate Array from Lattice Semiconductor Corporation designed for industrial applications. It combines substantial on-chip logic, embedded memory, and high I/O density in a compact ball-grid array package.
This device targets designs that require up to 68,000 logic elements, approximately 1.06 Mbits of embedded memory, and up to 500 I/Os, while operating across an industrial temperature range and a narrow core voltage window for stable power delivery.
Key Features
- Core Logic — Provides 68,000 logic elements for implementing custom digital functions and complex logic networks.
- Embedded Memory — Approximately 1.06 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
- I/O Density — Up to 500 I/O pins to interface with a wide range of external peripherals and subsystems.
- Power — Operates from a core voltage supply range of 1.14 V to 1.26 V to match tight power rails in many FPGA-based systems.
- Package & Mounting — Supplied in a 672-BBGA package (supplier device package: 672-FPBGA, 27×27) for surface-mount PCB assembly and compact board integration.
- Temperature & Grade — Industrial grade device rated for operation from −40°C to 100°C, suitable for demanding environments.
- Environmental Compliance — RoHS compliant to support regulatory and manufacturing requirements.
Unique Advantages
- High logic capacity: 68,000 logic elements enable large-scale programmable implementations without external logic expansion.
- Substantial on-chip memory: Approximately 1.06 Mbits of embedded RAM reduces dependence on external memory for many designs.
- Extensive I/O availability: Up to 500 I/Os simplify connectivity to sensors, transceivers, and other system interfaces.
- Industrial temperature range: Rated from −40°C to 100°C to maintain operation in wide-ranging environments.
- Compact BGA footprint: The 672-ball FPBGA (27×27) package enables high-density PCB implementations while supporting surface-mount assembly.
- RoHS compliant: Facilitates adherence to environmental and manufacturing standards.
Why Choose LFE2-70E-5FN672I?
The LFE2-70E-5FN672I is positioned for engineers and procurement teams seeking an industrial-grade FPGA with a balance of high logic capacity, embedded memory, and extensive I/O in a compact BGA package. Its defined core voltage range and wide operating temperature make it suitable for designs that require predictable power characteristics and reliable operation across challenging environments.
Choose this device when you need scalable programmable logic resources, on-chip memory to reduce external BOM, and a dense I/O complement—delivered in a surface-mount, RoHS-compliant package suitable for industrial applications.
Request a quote or submit an inquiry to receive pricing and availability for the LFE2-70E-5FN672I.