LFE2-70E-5F900C

The LFE2-70E-5F900C is an ECP2 family Field Programmable Gate Array (FPGA) in a 900-ball BGA package, offered in a commercial-grade device. It provides a combination of high logic density, embedded memory, and a large number of I/O for programmable logic applications.

With 68,000 logic elements, approximately 1.06 Mbits of embedded memory, and up to 583 I/O, this device is suited to commercial designs that require significant on-chip resources and high pin count within a surface-mount 900-FPBGA (31×31) package.

Key Features

• Logic Capacity  68,000 logic elements provide substantial programmable logic resources for complex digital functions and custom logic implementations.
• Embedded Memory  Approximately 1.06 Mbits of on-chip RAM (1,056,768 bits) to support buffering, packet handling, and local data storage without external memory.
• I/O Density  Up to 583 I/O pins support high‑pin‑count interfaces and dense connectivity for multi‑channel designs.
• Power Supply Range  Supported core supply range of 1.14 V to 1.26 V to match system power domains and regulator choices.
• Package and Mounting  900-BBGA / 900-FPBGA (31×31) package designed for surface-mount PCB assembly, enabling compact, high‑density board layouts.
• Operating Conditions  Commercial operating temperature range of 0°C to 85°C suitable for a wide variety of customer products.
• Regulatory  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-port communications equipment  Leverages the 583 I/O and large logic capacity to implement packet switching, protocol bridging, and multi‑channel interfaces.
• Data processing and acceleration  Uses the combination of logic elements and embedded memory for custom datapath acceleration and on-chip buffering.
• Embedded control systems  Provides programmable control logic and high‑density I/O for machine control, user interfaces, and peripheral aggregation in commercial products.

Unique Advantages

• High logic density: 68,000 logic elements enable complex designs and integration of multiple functions on a single device, reducing system BOM.
• Substantial embedded memory: Approximately 1.06 Mbits of on-chip RAM minimizes the need for external memory in many buffering and state‑holding applications.
• Extensive I/O capability: Up to 583 I/O pins allow direct connection to numerous peripherals and high‑port-count interfaces without additional expander chips.
• Compact BGA package: The 900-FPBGA (31×31) package delivers high integration in a surface-mount footprint for space-constrained PCBs.
• Commercial-grade suitability: Rated for 0°C to 85°C operation and RoHS compliant, matching typical commercial product development requirements.

Why Choose LFE2-70E-5F900C?

The LFE2-70E-5F900C positions itself as a high-density, commercial-grade FPGA option for designs that need a balance of logic capacity, embedded memory, and extensive I/O in a compact surface-mount package. Its specifications make it suitable for systems that consolidate multiple functions onto a single programmable device to reduce board complexity and part count.

This device is ideal for engineers and procurement teams developing commercial electronic products that require scalable programmable logic resources, on‑chip RAM, and high pin counts, combined with standard commercial operating temperature and RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability for the LFE2-70E-5F900C and to discuss how it can fit into your next design.