LFE2-70E-5FN672C

The LFE2-70E-5FN672C is a field programmable gate array (FPGA) in the ECP2 family designed for high-density programmable logic integration. It provides a large logic capacity and substantial embedded memory with a high I/O count in a compact 672-ball BGA package, suitable for commercial-grade embedded designs.

This device targets designs that require extensive programmable logic, significant on-chip RAM, and broad external connectivity while operating within a commercial temperature range and a low-voltage core supply.

Key Features

• Core Logic 68,000 logic elements delivering substantial programmable logic capacity for complex digital designs.
• Embedded Memory Approximately 1.06 Mbits of embedded memory (1,056,768 bits) to support buffering, lookup tables, and local data storage.
• I/O Density Up to 500 I/O pins to support broad peripheral interfacing and multi-channel connectivity.
• Power Core voltage supply range of 1.14 V to 1.26 V for low-voltage operation.
• Package and Mounting Surface mount 672-BBGA package (supplier package: 672-FPBGA, 27×27) offering a compact footprint for board-level integration.
• Operating Conditions Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance RoHS compliant, supporting lead-free manufacturing processes.

Typical Applications

• High-density I/O systems — Leverage the 500 available I/O pins for applications requiring extensive external connectivity and multiple interfaces.
• Custom digital processing — Use the 68,000 logic elements and embedded memory for medium-to-large custom logic blocks, datapath processing, and protocol implementation.
• Embedded control and glue logic — Implement system control, interface bridging, and custom peripheral logic within a single programmable device.

Unique Advantages

• High logic capacity: 68,000 logic elements enable consolidation of complex functions into one FPGA, reducing board-level component count.
• Significant on-chip memory: Approximately 1.06 Mbits of embedded RAM supports local buffering and state storage without external memory.
• Extensive I/O: 500 I/O pins provide flexibility to connect multiple peripherals and interfaces directly to the FPGA.
• Compact BGA package: The 672-BBGA (672-FPBGA 27×27) package allows high-density integration in space-constrained designs.
• Commercial operating range: Designed for standard commercial temperature environments (0 °C to 85 °C), suitable for a wide range of embedded products.
• RoHS compliant: Supports lead-free assembly and regulatory requirements for many regions and manufacturers.

Why Choose LFE2-70E-5FN672C?

The LFE2-70E-5FN672C delivers a balance of high logic density, meaningful on-chip memory, and a very large I/O count in a compact surface-mount BGA package. It is positioned for commercial embedded designs that require substantial programmable logic and flexible interfacing while maintaining a low-voltage core and RoHS compliance.

This FPGA is well suited to engineers seeking to reduce BOM complexity by integrating multiple digital functions into a single programmable device, offering scalability and design consolidation for mid- to high-complexity systems.

Request a quote or submit an inquiry today to get pricing and availability for the LFE2-70E-5FN672C.