LFE2-70E-5F672I

The LFE2-70E-5F672I is a Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation's ECP2 family. It combines a high logic capacity and substantial on-chip memory with a large I/O count to address dense, programmable logic designs.

With 68,000 logic elements, approximately 1.06 Mbits of embedded memory and 500 I/Os, this device targets applications that require high connectivity, significant local buffering, and operation across an industrial temperature range.

Key Features

• Core Logic Capacity 68,000 logic elements to implement complex digital logic and custom processing functions.
• Embedded Memory Approximately 1.06 Mbits of on-chip RAM (1,056,768 total RAM bits) for local buffering and data handling.
• I/O Density 500 available I/Os to support dense peripheral interfacing and multi-channel connectivity.
• Power Core supply range of 1.14 V to 1.26 V for the device core power rail.
• Package and Mounting 672-BBGA package, supplied as 672-FPBGA (27×27), implemented in a surface-mount form factor for compact board integration.
• Industrial Temperature Grade Specified for operation from −40 °C to 100 °C to meet industrial environment requirements.
• Regulatory RoHS compliant.

Typical Applications

• Industrial Control Implement control logic, custom interfaces and signal conditioning where industrial temperature range and robust I/O count are required.
• Communications and Networking Use the high I/O density and large logic capacity for protocol bridging, packet preprocessing or I/O aggregation tasks.
• Imaging and Sensor Processing Leverage embedded RAM and wide logic resources for local buffering, data formatting and preprocessing of sensor or imaging streams.
• Custom Interface and Peripheral Bridging Create glue logic and protocol converters to consolidate multiple peripherals and reduce external component count.

Unique Advantages

• High Logic Density: 68,000 logic elements allow implementation of complex designs without extensive external glue logic.
• Significant On-chip Memory: Approximately 1.06 Mbits of embedded RAM reduces reliance on external memory for many buffering and streaming use cases.
• Extensive I/O Count: 500 I/Os simplify system-level connectivity and support multi-channel interfaces on a single device.
• Industrial-grade Operation: −40 °C to 100 °C rating supports deployment in a wide range of industrial environments.
• Compact Surface-mount Package: 672-BBGA (672-FPBGA 27×27) delivers high pin-count in a compact board footprint for space-constrained designs.
• Low-voltage Core: Narrow core supply range (1.14 V–1.26 V) assists in predictable power-rail design for the FPGA core.

Why Choose LFE2-70E-5F672I?

The LFE2-70E-5F672I positions itself as a high-density, industrial-grade FPGA suitable for designs that demand extensive logic resources, substantial on-chip memory and broad I/O connectivity. Its specification set aligns with applications that consolidate multiple functions into a single programmable device, reducing BOM complexity and board-level routing.

Backed by Lattice Semiconductor Corporation, this device is appropriate for engineers developing scalable, robust embedded systems in industrial, communications and sensor-focused applications where temperature range, connectivity and local memory capacity matter.

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