LFE2-70E-6F672C

The LFE2-70E-6F672C is an ECP2 Field Programmable Gate Array (FPGA) IC offering a high logic capacity of 68,000 logic elements and approximately 1.06 Mbits of on-chip RAM (1,056,768 bits). It provides up to 500 I/O pins to support complex interfacing requirements.

Packaged in a 672‑BBGA (supplier package: 672‑FPBGA, 27×27) surface-mount package, the device operates from a 1.14 V to 1.26 V supply and is specified for commercial temperature operation (0 °C to 85 °C). The part is RoHS compliant.

Key Features

• Core Logic  68,000 logic elements for implementing large combinational and sequential logic functions on-chip.
• Embedded Memory  Approximately 1.06 Mbits of on-chip RAM (1,056,768 bits) for local buffering and state storage.
• I/O Capacity  Up to 500 I/O pins to support multiple external interfaces and peripherals.
• Supply Voltage  Operates from a 1.14 V to 1.26 V supply voltage.
• Package & Mounting  672‑BBGA package (supplier: 672‑FPBGA, 27×27) with surface-mount mounting for high-density PCB layouts.
• Operating Range  Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance  RoHS compliant for lead‑free manufacturing requirements.

Typical Applications

• High-density logic designs  Implement extensive on-chip logic functions using 68,000 logic elements without relying on multiple discrete devices.
• I/O‑intensive systems  Use up to 500 I/O pins to connect sensors, peripherals, and external interfaces in space-constrained designs.
• On-chip buffering and storage  Approximately 1.06 Mbits of embedded memory supports local data buffering and temporary state retention.

Unique Advantages

• High logic capacity: 68,000 logic elements enable consolidation of large logic functions into a single FPGA device.
• Substantial on-chip RAM: Approximately 1.06 Mbits of RAM reduces dependence on external memory for intermediate data storage.
• Extensive I/O: Up to 500 I/O pins provide flexibility when interfacing with multiple peripherals and parallel buses.
• Compact packaging: 672‑BBGA (27×27) surface-mount package supports high-density PCB integration.
• Low-voltage operation: 1.14 V to 1.26 V supply range aligns with modern low-voltage system designs.
• RoHS compliant: Supports lead-free production and regulatory requirements.

Why Choose LFE2-70E-6F672C?

The LFE2-70E-6F672C combines a large logic fabric, meaningful on-chip memory, and a high I/O count in a compact 672‑BBGA surface-mount package. Its electrical and thermal ratings make it a fit for commercial-temperature electronic designs that require significant on-chip integration and dense interfacing.

This FPGA is suitable for development teams and procurement seeking a highly integrated programmable device with verifiable specifications for logic capacity, embedded RAM, I/O density, package type, voltage range, and RoHS compliance.

Request a quote or contact sales to discuss availability, pricing, and to obtain further product information for the LFE2-70E-6F672C.