LFE2-70E-6FN672C

The LFE2-70E-6FN672C is a Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation's ECP2 family, packaged in a 672-ball BGA. It delivers high-density programmable logic with a large I/O count and embedded on-chip memory, designed for commercial applications that require flexible system integration.

This device is suited for designs needing up to 68,000 logic elements, approximately 1.06 Mbits of embedded memory, and up to 500 I/O signals while operating at a supply voltage between 1.14 V and 1.26 V and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  Approximately 68,000 logic elements provide substantial programmable logic capacity for complex combinational and sequential designs.
• Embedded Memory  Total on-chip RAM of 1,056,768 bits (approximately 1.06 Mbits) for buffering, FIFOs, and local data storage.
• I/O Density  Up to 500 I/O pins to support high-pin-count interfaces and multiple parallel connections.
• Power  Operates from a core supply range of 1.14 V to 1.26 V for compatibility with low-voltage system rails.
• Package & Mounting  672-ball BGA (supplier package: 672-FPBGA, 27×27 mm) in a surface-mount form factor for compact, high-density board layouts.
• Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operation.
• Regulatory  RoHS compliant, meeting common environmental removal-of-hazardous-materials requirements.

Typical Applications

• Embedded system integration  Implements custom logic, glue logic, and protocol bridging where significant on-chip logic and memory are required.
• High-density I/O interfaces  Handles designs that require many parallel connections or complex I/O routing using up to 500 available pins.
• Prototyping and development platforms  Provides a reprogrammable platform for validating hardware architectures that need substantial logic and embedded RAM.

Unique Advantages

• High logic capacity:  About 68,000 logic elements let you implement large custom logic blocks and state machines without immediate migration to larger families.
• Significant embedded memory:  Approximately 1.06 Mbits of on-chip RAM reduces external memory dependence for many buffering and temporary storage needs.
• Large I/O budget:  Up to 500 I/O pins simplify integration of multiple peripherals and parallel interfaces on a single device.
• Compact BGA package:  The 672-ball FPBGA (27×27 mm) enables dense PCB layouts while maintaining high pin count and good routing density.
• Commercial temperature rating:  Specified for 0 °C to 85 °C, aligning with a wide range of commercial electronic product requirements.
• RoHS compliant:  Supports environmentally conscious design and regulatory compliance for lead-free manufacturing.

Why Choose LFE2-70E-6FN672C?

The LFE2-70E-6FN672C balances substantial programmable logic capacity, embedded memory, and a high I/O count in a compact 672-BBGA package for commercial applications. Its core voltage range and RoHS compliance make it suitable for contemporary board designs that prioritize low-voltage operation and environmental compliance.

This device is well suited to engineers and procurement teams building mid-to-high complexity FPGA-based solutions who need a commercially rated, reprogrammable logic device with ample resources for integration, prototyping, and production deployment.

Request a quote or submit an inquiry to obtain pricing, lead time, and availability details for the LFE2-70E-6FN672C.