LFE2-70E-7F672C

The LFE2-70E-7F672C is an ECP2 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation designed for commercial-grade system integration. The device provides approximately 68,000 logic elements, roughly 1.06 Mbits of embedded RAM, and up to 500 I/Os in a 672-ball FPBGA (27 × 27 mm) package.

This surface-mount FPGA is targeted at designs that require significant on-chip logic and memory capacity, large I/O counts, and a compact BGA footprint. The part operates from a supply range of 1.14 V to 1.26 V and is specified for 0 °C to 85 °C operation. Family-level capabilities described in the manufacturer datasheet include advanced DSP blocks, programmable I/O standards and flexible on-chip memory architectures.

Key Features

• Logic Capacity  Approximately 68,000 logic elements (logic cells) to support complex combinational and sequential logic integration.
• Embedded Memory  Total on-chip RAM of 1,056,768 bits (approximately 1.06 Mbits) for data buffering, FIFOs and state storage.
• I/O Density  Up to 500 user I/Os to interface with peripherals, memory devices and external logic.
• DSP Resources  Family datasheet lists enhanced sysDSP blocks and multiple 18×18 multipliers for multiply-accumulate and DSP workloads (family-level capability).
• Package  672-ball FPBGA (27 × 27 mm) supplier device package; surface-mount mounting type suited for compact board-level designs.
• Power and Temperature  Supply voltage range of 1.14 V to 1.26 V with a commercial operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS-compliant construction for environmental regulatory alignment.
• Flexible I/O Standards (Family-Level)  Family documentation describes programmable sysI/O buffer support for a wide set of I/O standards (LVTTL/LVCMOS, SSTL, HSTL, LVDS and others) for diverse interface needs.

Typical Applications

• Communications and Networking  Use the device’s high logic density, extensive I/O and family-level SERDES/I/O capabilities to implement protocol bridging, packet processing and interface logic.
• Signal Processing and DSP  Embedded memory and family DSP blocks support buffering, filtering and multiply-accumulate workloads in DSP pipelines.
• System Integration and Prototyping  Compact 672-BBGA package and large logic/memory resources make the device suitable for system-on-module designs and platform development.
• High-Density I/O Control  Large I/O count enables complex sensor aggregation, parallel data capture, and multi-channel control interfaces.

Unique Advantages

• High logic integration: Approximately 68,000 logic elements allow integration of substantial digital functionality on a single device, reducing external component count.
• Significant on-chip memory: About 1.06 Mbits of embedded RAM supports data buffering and local storage, minimizing external memory requirements.
• Large I/O complement: Up to 500 I/Os provide flexibility for multi-channel interfaces and complex board-level interconnects.
• Compact BGA footprint: 672-ball FPBGA (27 × 27 mm) balances high pin count with a compact, PCB-friendly package.
• Commercial-grade readiness: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream electronic product environments.
• Family-supported capabilities: Datasheet-documented features such as programmable I/O standards and DSP blocks help accelerate system design using family-level IP and tools.

Why Choose LFE2-70E-7F672C?

The LFE2-70E-7F672C combines substantial logic density, ample embedded memory and a high I/O count in a compact 672-ball FPBGA package, making it suitable for commercial designs that need on-chip integration and flexible interfacing. Its supply and temperature specifications match common board-level power and environmental requirements for commercial applications.

Designed within the ECP2 family, this device benefits from documented family capabilities—such as enhanced DSP resources and broad I/O standard support—enabling scalable designs and reuse of family-level IP and design flows for faster time to market.

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