LFE2-70E-7FN900C

The LFE2-70E-7FN900C is an ECP2 Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for commercial-grade, surface-mount applications. It integrates 68,000 logic elements and a high I/O count to support dense programmable logic implementations.

With approximately 1.06 Mbits of embedded memory and a supply voltage range of 1.14 V to 1.26 V, this device is suited for designs that require substantial on-chip RAM, extensive I/O, and a compact 900-BBGA footprint in a commercial temperature range.

Key Features

• Core Logic  68,000 logic elements provide the configurable logic capacity needed for complex digital designs.
• Embedded Memory  Approximately 1.06 Mbits of on-chip RAM (1,056,768 bits) for buffering, FIFOs, and intermediate data storage.
• I/O Density  583 I/O pins accommodate high-pin-count interfaces and multi-channel connectivity in a single device.
• Power  Operates from a supply voltage range of 1.14 V to 1.26 V to match system power rails and design requirements.
• Package & Mounting  900-BBGA package (supplier device package: 900-FPBGA, 31×31) for a compact, surface-mount implementation.
• Temperature & Grade  Commercial grade device with an operating temperature range of 0°C to 85°C.
• Compliance  RoHS compliant to meet environmental substance requirements.

Typical Applications

• High-density I/O systems  Use the 583 I/O pins for multi-channel data aggregation, protocol bridging, or front-end interface aggregation where many external connections are required.
• Embedded logic and acceleration  Deploy the 68,000 logic elements and on-chip RAM to implement custom datapaths, packet processing, or control logic in commercial equipment.
• Prototyping and evaluation  Leverage the FPGA’s logic capacity and package for board-level prototyping of complex digital functions in commercial product development.

Unique Advantages

• High integration density: 68,000 logic elements and approximately 1.06 Mbits of embedded memory reduce the need for external components and simplify system design.
• Extensive I/O availability: 583 I/O pins enable consolidation of multiple interfaces into a single programmable device, lowering BOM complexity.
• Compact surface-mount package: 900-BBGA (900-FPBGA, 31×31) provides a space-efficient footprint for high-density PCB layouts.
• Tight power supply window: Support for 1.14 V to 1.26 V supply rails aligns with low-voltage system architectures.
• Commercial-grade reliability: Rated for 0°C to 85°C operation and RoHS compliant for mainstream commercial deployments.

Why Choose LFE2-70E-7FN900C?

The LFE2-70E-7FN900C balances substantial logic capacity, on-chip memory, and a very high I/O count in a compact 900-BBGA package, making it a practical choice for commercial designs that require dense programmable logic and interface consolidation. Its supply voltage range and commercial temperature rating make it well suited for mainstream electronic products and prototype platforms.

Manufactured by Lattice Semiconductor Corporation and provided RoHS compliant, this FPGA offers a clear combination of integration and I/O capability for engineers looking to implement complex digital functions while minimizing external components and PCB area.

Request a quote or submit an inquiry to receive pricing and availability for the LFE2-70E-7FN900C.