LFE2-70E-7F900C

The LFE2-70E-7F900C is an ECP2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a high-density programmable logic fabric with a large I/O count and embedded memory for commercial-grade designs.

With 68,000 logic elements and approximately 1.06 Mbits of on-chip RAM, this surface-mount 900-BBGA device targets commercial applications requiring significant integration of logic, memory and I/O within a compact package.

Key Features

• Logic Capacity  Provides 68,000 logic elements to implement complex programmable logic functions and custom digital architectures.
• Embedded Memory  Approximately 1.06 Mbits of total on-chip RAM to support buffering, state machines, and local data storage without external memory.
• I/O Density  Offers 583 user I/O pins to support high-connectivity designs and multiple parallel interfaces.
• Power  Operates from a core voltage range of 1.14 V to 1.26 V, allowing designers to plan power delivery and sequencing to match system requirements.
• Package & Mounting  Supplied in a 900‑BBGA (900‑FPBGA, 31×31 mm) package for surface-mount assembly, enabling a compact board footprint for high-density systems.
• Operating Range  Commercial-grade operating temperature range of 0 °C to 85 °C suitable for standard commercial environments.
• Compliance  RoHS compliant, meeting common environmental restrictions for electronics manufacturing.

Typical Applications

• High‑I/O Interface Systems  Large pin count supports designs that require multiple parallel interfaces, dense sensor or connector arrays, and extensive peripheral connectivity.
• Embedded Control and Processing  Ample logic elements and on‑chip RAM enable implementation of custom controllers, protocol bridges, and data processing pipelines without immediate reliance on external components.
• Compact, High‑Density Board Designs  The 900‑FPBGA (31×31 mm) package and surface-mount mounting allow integration into space-constrained commercial products.

Unique Advantages

• High Logic Integration: 68,000 logic elements let you consolidate multiple functions into a single device, reducing board-level complexity.
• Significant On‑Chip Memory: Approximately 1.06 Mbits of embedded RAM supports local buffering and state storage, lowering dependence on external memory.
• Extensive I/O Capability: 583 I/Os accommodate complex interfacing requirements and multiple simultaneous peripherals.
• Compact Packaging: The 900‑FPBGA (31×31 mm) package delivers a high pin count in a compact footprint for dense system designs.
• Commercial‑Grade Suitability: Specified for 0 °C to 85 °C operation and RoHS compliance, aligning with standard commercial manufacturing and deployment requirements.
• Predictable Power Envelope: Narrow core voltage range (1.14 V to 1.26 V) simplifies power-supply design and verification.

Why Choose LFE2-70E-7F900C?

The LFE2-70E-7F900C positions itself as a high-density, commercial-grade FPGA option for designers who need substantial logic capacity, significant on-chip memory, and a very large I/O count in a compact surface-mount package. Its combination of 68,000 logic elements, approximately 1.06 Mbits of embedded RAM, and 583 I/Os makes it well suited for consolidating multiple digital functions onto a single device.

Manufactured by Lattice Semiconductor Corporation and delivered in a 900‑BBGA/900‑FPBGA (31×31) package, this device supports developers and OEMs targeting commercial applications that require integration, scalability, and adherence to RoHS environmental requirements.

Request a quote or submit an inquiry to begin procurement of the LFE2-70E-7F900C and evaluate its fit for your next commercial FPGA design.