LFE2-70E-6FN672I

The LFE2-70E-6FN672I is an ECP2-series field programmable gate array from Lattice Semiconductor Corporation. It integrates 68,000 logic elements with approximately 1.06 Mbits of on-chip RAM and up to 500 I/Os, delivering a high-density programmable fabric for complex system integration.

Designed for surface-mount applications, this device combines extensive logic resources, DSP capability and flexible I/O to address demanding embedded, industrial and communication interface designs within a 672-ball BGA (27 × 27 mm) package.

Key Features

• Core Logic 68,000 logic elements provide high logic density for integration of complex digital functions and glue logic.
• Embedded Memory Total on-chip RAM of 1,056,768 bits (approximately 1.06 Mbits) for block and distributed memory requirements.
• DSP Resources Architecture-level sysDSP resources (series-level specification) supporting high-performance multiply and accumulate operations for signal processing tasks.
• I/O Capacity Up to 500 programmable I/Os to support wide bus widths, multi-channel interfaces and high pin-count system designs.
• Programmable I/O Standards Family-level programmable sysI/O buffer support for a broad set of standards including LVTTL, LVCMOS (3.3/2.5/1.8/1.5/1.2 V), SSTL, HSTL and differential standards such as LVDS and LVPECL.
• Clocking and Timing Integrated PLL and DLL resources (family-level provision) to support clock multiplication, division and phase/delay adjustment for complex timing domains.
• Power Core voltage supply range from 1.14 V to 1.26 V, enabling operation within the specified device power envelope.
• Package & Mounting 672-ball FPBGA (27 × 27 mm) package, surface-mount mounting type suitable for compact board layouts.
• Industrial Temperature Range Rated for operation from -40 °C to 100 °C, supporting industrial-temperature applications.
• Standards-level Design Support Series-level device support includes configuration options, on-chip debug and design flow compatibility with Lattice design tools.

Typical Applications

• Embedded signal processing — Leverage on-chip memory and sysDSP resources for real-time multiply/accumulate operations and DSP pipelines.
• High-pin-count I/O systems — Use the 500 I/Os for wide parallel interfaces, multi-channel data acquisition or board-level bridging.
• Memory interface controllers — Implement DDR/DDR2 memory interfaces and associated timing using the device’s dedicated I/O and clocking resources.
• Industrial control and automation — Industrial temperature rating and robust packaging make the device suitable for control, motor drive logic and sensor aggregation in industrial environments.

Unique Advantages

• High logic density: 68,000 logic elements allow consolidation of multiple functions into a single device, reducing BOM and board complexity.
• Substantial on-chip memory: Approximately 1.06 Mbits of embedded RAM supports large buffering, packet handling and local data storage without external SRAM.
• Extensive I/O count: Up to 500 I/Os enables complex interfacing and parallel data paths for high-throughput designs.
• Flexible I/O standards: Family-level support for a wide range of single-ended and differential standards simplifies integration with diverse peripherals and memory.
• Industrial operating range: -40 °C to 100 °C rating supports deployments in temperature-challenging environments.
• Compact BGA package: 672-ball FPBGA (27 × 27 mm) balances high I/O density with a footprint suitable for space-constrained systems.

Why Choose LFE2-70E-6FN672I?

The LFE2-70E-6FN672I positions itself as a high-density, versatile FPGA for engineers who need a balance of logic capacity, on-chip memory and extensive I/O in a single surface-mount package. Its combination of logic elements, embedded RAM and DSP resources supports complex embedded processing, interface bridging and system integration tasks while operating across an industrial temperature range.

Supported by the ECP2 family design ecosystem and configuration features, this device is suited to teams building scalable, robust systems requiring long-term design support and predictable integration into industrial and communication-oriented products.

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