LFE2-70E-6FN900C

The LFE2-70E-6FN900C is an ECP2 family field programmable gate array (FPGA) supplied by Lattice Semiconductor Corporation. It provides a high logic-element count and substantial embedded RAM in a compact 900-pin BGA package for commercial-grade designs.

Key characteristics include approximately 68,000 logic elements, roughly 1.06 Mbits of on-chip RAM, a high I/O count of 583 pins, a 900-FPBGA (31×31) surface-mount package, and operation across a 1.14 V to 1.26 V supply range with a commercial temperature rating of 0 °C to 85 °C.

Key Features

• Core / Logic Capacity  Approximately 68,000 logic elements for implementing complex digital functions and glue logic.
• Embedded Memory  Total on-chip RAM of 1,056,768 bits—approximately 1.06 Mbits—suitable for buffering, FIFOs, and small lookup tables.
• High I/O Density  Up to 583 I/O pins to support multiple high-density peripheral and subsystem interfaces.
• Package & Mounting  900-BBGA package case with supplier device package 900-FPBGA (31×31); surface-mount mounting for compact system integration.
• Power  Nominal operating supply range from 1.14 V to 1.26 V to match system power-rail requirements.
• Operating Range  Commercial grade operation from 0 °C to 85 °C for standard commercial applications.
• Environmental Compliance  RoHS compliant.

Unique Advantages

• High logic density: The approximately 68,000 logic elements enable implementation of sizeable custom logic blocks and system-level functions on a single device, reducing external component count.
• Substantial on-chip RAM: About 1.06 Mbits of embedded memory supports buffering and state storage without immediate need for external memory.
• Extensive I/O capability: 583 I/O pins allow direct connection to numerous peripherals and parallel interfaces, simplifying board-level routing and connectivity.
• Compact surface-mount package: The 900-FPBGA (31×31) package delivers high pin count in a space-efficient footprint for dense system designs.
• Commercial operating range: Rated for 0 °C to 85 °C operation, suitable for mainstream commercial electronics and embedded applications.
• Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and procurement requirements.

Why Choose LFE2-70E-6FN900C?

The LFE2-70E-6FN900C positions itself as a high-capacity, commercially rated FPGA option for designs that require large logic resources, significant embedded memory, and a high I/O count in a compact BGA package. Its combination of approximately 68,000 logic elements, about 1.06 Mbits of on-chip RAM, and 583 I/O pins makes it suitable for developers seeking to consolidate logic and interfaces onto a single programmable device.

Manufactured by Lattice Semiconductor Corporation and delivered in a 900-FPBGA (31×31) surface-mount package, this device is aimed at teams building commercial embedded systems that value integration density, predictable operating conditions, and RoHS-compliant components.

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