LFE2-70E-7FN672C

IC FPGA 500 I/O 672FPBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 500 1056768 68000 672-BBGA

Quantity 804 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package672-FPBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O500Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8500Number of Logic Elements/Cells68000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1056768

Overview of LFE2-70E-7FN672C – ECP2 Field Programmable Gate Array (FPGA) IC 500 1056768 68000 672-BBGA

The LFE2-70E-7FN672C is an ECP2 family Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation. It delivers a high-capacity programmable fabric with approximately 68,000 logic elements and substantial embedded memory for complex digital designs in commercial applications.

With up to 500 I/O, a supply range of 1.14 V to 1.26 V, and a 672-ball BGA footprint, this device targets commercial embedded systems that require dense logic, on-chip RAM, and compact board-level integration.

Key Features

  • Logic Capacity  Approximately 68,000 logic elements to implement sizable custom digital functions and state machines.
  • Embedded Memory  Approximately 1.06 Mbits of on-chip RAM (1,056,768 bits) for buffering, lookup tables, and local data storage.
  • I/O Density  500 I/O available to support multiple interfaces, parallel buses, and extensive peripheral connectivity.
  • Power  Core voltage supply range from 1.14 V to 1.26 V for designs targeting low-voltage FPGA operation.
  • Package & Mounting  672-BBGA package (supplier device package: 672-FPBGA 27×27) provided in a surface-mount form factor for compact PCB layouts.
  • Operating Range & Grade  Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Commercial Embedded Systems  Use the FPGA’s logic capacity and on-chip RAM to implement custom control, signal processing, or protocol handling in commercial electronics.
  • High-Density I/O and Interface Bridging  Leverage 500 I/O to aggregate, translate, or route multiple parallel and serial interfaces on a single device.
  • Custom Digital Processing  Deploy the large logic resource and embedded memory for application-specific compute tasks, data buffering, and real-time processing.

Unique Advantages

  • High Logic Integration:  Approximately 68,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
  • Substantial On-Chip Memory:  About 1.06 Mbits of embedded RAM supports local data storage and latency-sensitive buffering without external memory.
  • Extensive I/O Count:  500 I/O points simplify integration with a wide range of peripherals and interface standards on one device.
  • Compact BGA Package:  672-BBGA (672-FPBGA 27×27) provides a high-pin-count solution in a compact surface-mount footprint for space-constrained designs.
  • Commercial Temperature Suitability:  Rated for 0 °C to 85 °C operation to meet standard commercial deployment requirements.
  • RoHS Compliant:  Environmentally compliant manufacturing helps meet regulatory and supply-chain requirements.

Why Choose LFE2-70E-7FN672C?

The LFE2-70E-7FN672C combines a large logic fabric, significant embedded memory, and high I/O count in a compact 672-ball BGA package, making it well suited for commercial designs that require dense programmable logic and on-chip data storage. Its 1.14 V to 1.26 V core supply and surface-mount package enable efficient board integration where space and power are considerations.

Manufactured by Lattice Semiconductor Corporation, this FPGA is aimed at teams developing commercial embedded systems, custom digital processing solutions, and high-density interface applications that benefit from consolidated functionality and reduced BOM complexity.

Request a quote or submit an inquiry to obtain pricing and availability for the LFE2-70E-7FN672C.

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