LFE2-70SE-5F672C

The LFE2-70SE-5F672C is an ECP2 series field programmable gate array (FPGA) supplied in a 672-ball BGA package. It combines a sizeable programmable logic fabric with on-chip embedded memory and a high I/O count to address designs that require configurable logic, on-chip storage, and broad external connectivity.

With 8,500 CLBs and 68,000 logic elements, approximately 1.06 Mbits of embedded RAM and up to 500 I/O pins, this commercial-grade device targets applications that need significant logic resources and flexible interfacing while operating from a 1.14 V to 1.26 V core supply.

Key Features

• Core Logic – 8,500 CLBs delivering 68,000 logic elements to implement complex custom logic and state machines.
• On-Chip Memory – Approximately 1.06 Mbits of embedded RAM for buffering, FIFOs, and memory-intensive logic functions.
• I/O Density – Up to 500 user I/O pins to support multiple external buses, interfaces and parallel connections.
• Power – Core voltage range of 1.14 V to 1.26 V for compatibility with low-voltage system designs.
• Package & Mounting – 672-ball FPBGA (27 × 27 mm) package case, designed for surface-mount assembly to minimize board footprint.
• Operating Conditions & Grade – Commercial-grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance – RoHS compliant for reduced hazardous substances in manufacturing.

Typical Applications

• High‑I/O interface bridging – Use the 500 available I/O pins to connect multiple peripheral buses, serializers/deserializers, or parallel interfaces.
• On‑chip buffering and data handling – Leverage approximately 1.06 Mbits of embedded RAM for buffering, packet queuing or FIFO implementations.
• Custom logic implementation – Deploy the 68,000 logic elements to implement complex state machines, protocol engines, or glue logic between subsystems.
• Compact, board‑level integration – The 672-FPBGA package and surface-mount mounting support dense PCB layouts where board space is at a premium.

Unique Advantages

• Significant logic capacity: 68,000 logic elements enable large or partitioned designs without immediate migration to a larger device.
• Substantial embedded memory: Approximately 1.06 Mbits of RAM reduces dependence on external memory for many buffering and temporary storage needs.
• Extensive I/O connectivity: Up to 500 I/O pins simplify interfacing to multiple peripherals and parallel data paths.
• Compact BGA footprint: 672-ball FPBGA (27 × 27 mm) supports high-density board designs while retaining robust solder joint geometry.
• Low-voltage core operation: 1.14 V–1.26 V supply range aligns with modern low-voltage system designs, aiding power budgeting.
• RoHS compliant: Meets environmental requirements for reduced hazardous substances in production.

Why Choose LFE2-70SE-5F672C?

The LFE2-70SE-5F672C positions itself as a versatile commercial-grade FPGA offering a balance of programmable logic, embedded memory and high I/O density in a compact BGA package. Its combination of 8,500 CLBs (68,000 logic elements), approximately 1.06 Mbits of RAM and up to 500 I/Os makes it well suited to system designs that require significant on-chip resources and flexible interfacing while operating within a standard commercial temperature range.

This device is appropriate for teams developing mid-density programmable solutions that value integration, board-space efficiency and RoHS compliance. Its specifications support scalable designs where on-chip logic and memory reduce external component count and simplify system architecture.

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