LFE2-70SE-5F672I

The LFE2-70SE-5F672I is an ECP2 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, supplied in a 672-ball BGA package. Designed for industrial-grade applications, it provides a combination of large logic capacity, significant on-chip RAM, and a high I/O count for systems that require dense integration and robust operating range.

With 68,000 logic elements, approximately 1.06 Mbits of embedded memory and 500 I/Os, this device targets FPGA-based designs that need substantial programmable logic and memory in a compact surface-mount form factor.

Key Features

• Core Logic 68,000 logic elements and 8,500 logic units provide substantial programmable fabric for complex logic, glue logic, and custom processing functions.
• Embedded Memory Approximately 1.06 Mbits of on-chip RAM (1,056,768 total bits) for buffering, FIFOs and data storage within user logic.
• I/O Density 500 I/Os to support large parallel interfaces, board-level connectivity and multiple peripheral signals.
• Power Supply Core voltage supply range of 1.14 V to 1.26 V, enabling integration into systems with controlled core power rails.
• Package and Mounting 672-ball BGA (672-BBGA / supplier package 672-FPBGA, 27×27 mm) in a surface-mount configuration for compact board-level integration.
• Temperature and Grade Industrial-grade device rated for an operating temperature range of −40°C to 100°C, suitable for many industrial environments.
• Compliance RoHS compliant, supporting lead-free manufacturing processes and regulatory requirements.

Typical Applications

• Industrial Control — Implement motor control logic, PLC interfacing and custom automation functions where industrial temperature range and high I/O are required.
• High-Density I/O Systems — Manage large parallel data paths and multiple peripheral interfaces using the device's 500 I/Os.
• Embedded System Integration — Provide custom glue logic, protocol bridging and on-board processing with its substantial logic element count and embedded RAM.

Unique Advantages

• Large Logic Capacity: 68,000 logic elements support complex designs and reduce the need for multiple devices in many implementations.
• Significant On-Chip Memory: Approximately 1.06 Mbits of embedded RAM enables local buffering and state storage without external memory.
• High I/O Count: 500 I/Os simplify board routing for multi-channel systems and reduce dependence on expansion components.
• Industrial Temperature Range: Rated from −40°C to 100°C to meet the environmental demands of many industrial installations.
• Compact BGA Package: 672-ball BGA (27×27 mm) delivers high density in a surface-mount form factor for space-constrained boards.
• RoHS Compliant: Supports lead-free assembly and environmental compliance in product designs.

Why Choose LFE2-70SE-5F672I?

The LFE2-70SE-5F672I is positioned for designs that require a large programmable fabric, meaningful on-chip memory and broad I/O capability in an industrial-rated package. Its combination of 68,000 logic elements, approximately 1.06 Mbits of RAM and 500 I/Os provides designers with integration options that can reduce overall system complexity and board-level component count.

This device is well suited to engineers developing industrial control systems, high-density interface boards and embedded platforms that benefit from a compact 672-BBGA surface-mount package and an extended operating temperature range. RoHS compliance further supports long-term manufacturability in lead-free production flows.

Request a quote or submit a request for pricing and availability for the LFE2-70SE-5F672I to evaluate it for your next FPGA-based design.