LFE2-70SE-5FN672I

The LFE2-70SE-5FN672I is an ECP2-series Field Programmable Gate Array designed for industrial applications that require substantial logic capacity, on-chip memory, and a high I/O count. Its combination of approximately 68,000 logic elements, roughly 1.06 Mbits of embedded memory, and up to 500 I/Os enables integration of complex digital functions in a single device.

Packaged in a 672-BBGA (672-FPBGA, 27×27) surface-mount package and rated for operation from -40°C to 100°C, this FPGA is suited to designs that need high integration and industrial temperature support while operating at a 1.14 V to 1.26 V supply range.

Key Features

• Core Logic Approximately 68,000 logic elements provide substantial capacity for glue logic, custom datapaths, and control functions.
• Embedded Memory Approximately 1.06 Mbits of on-chip RAM to support buffering, state storage, and local data processing without external memory.
• I/O Density Up to 500 I/Os to support complex interfacing and multiple parallel connections to peripherals or subsystems.
• Package & Mounting 672-BBGA (supplier device package: 672-FPBGA, 27×27) in a surface-mount form factor for compact board-level integration.
• Power Low-voltage operation with a supply range of 1.14 V to 1.26 V for designs targeting optimized power domains.
• Temperature Range Industrial operating range from -40°C to 100°C to support deployment in demanding environmental conditions.
• Regulatory Status RoHS compliant for adherence to common environmental requirements.

Typical Applications

• Industrial Embedded Systems — Use the FPGA’s industrial temperature rating and logic density to implement control, sequencing, and real-time processing functions in industrial equipment.
• High-density I/O Interfaces — The 500 I/O capability supports designs requiring numerous external connections, parallel buses, or mixed-signal interface management.
• Logic-intensive Designs — Approximately 68,000 logic elements enable integration of custom accelerators, protocol handling, and complex glue logic without multiple discrete devices.
• On-chip Memory-dependent Functions — Roughly 1.06 Mbits of embedded RAM provide local buffering and state storage for dataflow processing and short-term data retention.

Unique Advantages

• High Integration: Large logic capacity and significant on-chip memory reduce the need for external components and simplify BOM and board layout.
• Extensive I/O Resources: Up to 500 I/Os enable consolidation of multiple interfaces onto a single device, streamlining system-level connectivity.
• Industrial Temperature Support: Rated from -40°C to 100°C for designs that must operate reliably across a wide thermal range.
• Compact Ball Grid Array Package: 672-BBGA (672-FPBGA, 27×27) provides a high-pin-count solution in a surface-mount footprint suited to space-constrained PCBs.
• Low-Voltage Operation: 1.14 V to 1.26 V supply range supports designs targeting lower core voltages and controlled power domains.
• RoHS Compliant: Conforms to common environmental requirements for electronics manufacturing and end products.

Why Choose LFE2-70SE-5FN672I?

The LFE2-70SE-5FN672I positions itself as a high-capacity, industrial-grade FPGA that balances logic density, embedded memory, and I/O resources for integrated digital designs. Its voltage and temperature specifications make it suitable for engineers seeking a robust FPGA platform for industrial embedded applications and complex interface consolidation.

Designers who require scalable logic resources, substantial on-chip RAM, and a large number of I/Os will find this device useful for reducing external components and simplifying system architecture while maintaining compliance with RoHS requirements.

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