LFE2-70SE-6F672C

The LFE2-70SE-6F672C is an ECP2 family Field Programmable Gate Array (FPGA) supplied in a 672-ball BGA package. It provides a combination of substantial logic capacity, on-chip memory, and high I/O count suited for compact, I/O-dense designs.

This commercial-grade, surface-mount FPGA targets designs that require up to 500 I/O pins, roughly 1.0568 Mbits of embedded RAM, and approximately 68,000 logic elements while operating within a 0 °C to 85 °C range and a 1.14 V to 1.26 V supply window.

Key Features

• Logic Capacity — Approximately 68,000 logic elements provide the combinational and sequential resources for complex glue logic, protocol handling, and control algorithms.
• Embedded Memory — Approximately 1.0568 Mbits of on-chip RAM for buffering, FIFOs, and small data stores without external memory.
• I/O Density — Up to 500 I/O pins to support multi-interface designs and a wide range of peripheral connections.
• Power Supply — Operates from a 1.14 V to 1.26 V supply range to match low-voltage system domains.
• Package and Mounting — 672-ball FPBGA (27 × 27) package in a surface-mount form factor for high-density PCB integration.
• Operating Grade and Temperature — Commercial grade with an operating temperature range of 0 °C to 85 °C for standard consumer and industrial-adjacent applications.
• RoHS Compliance — Environmentally compliant manufacturing status.

Typical Applications

• Interface and Protocol Bridging — High I/O count enables aggregation and translation between multiple serial and parallel interfaces on a single device.
• Embedded Control and Logic — Large logic-element capacity supports complex control, state machines, and custom hardware accelerators for embedded systems.
• On-Chip Data Buffering — Approximately 1.0568 Mbits of embedded RAM is useful for packet buffering, FIFO implementations, and temporary data storage without external RAM.

Unique Advantages

• High Integration: Large logic element count and substantial embedded RAM reduce the need for external glue logic and memory, simplifying BOM and PCB routing.
• I/O-Heavy Designs: Up to 500 I/Os accommodate multi-port connectivity and interface consolidation in compact systems.
• Compact BGA Package: The 672-BBGA (27 × 27) package enables high-density board layouts while maintaining significant resource capacity.
• Low-Voltage Compatibility: Narrow supply range (1.14 V–1.26 V) aligns with modern low-voltage system domains for streamlined power design.
• Commercial Suitability: Commercial grade and RoHS compliance make the device appropriate for consumer and standard industrial applications.

Why Choose LFE2-70SE-6F672C?

The LFE2-70SE-6F672C balances substantial programmable logic, on-chip RAM, and a high I/O count in a compact 672-ball BGA package. It is positioned for engineers designing I/O-centric, memory-buffering, or control-focused systems that require significant logic resources without excessive board area.

With its defined supply and temperature ranges and RoHS compliance, this FPGA offers a verifiable, scalable option for commercial designs where integration density, I/O flexibility, and embedded memory are primary considerations.

Request a quote or contact sales to discuss pricing, availability, and how the LFE2-70SE-6F672C can fit into your next design.