LFE2-70SE-5FN900I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 583 1056768 68000 900-BBGA |
|---|---|
| Quantity | 670 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 900-FPBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 900-BBGA | Number of I/O | 583 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8500 | Number of Logic Elements/Cells | 68000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1056768 |
Overview of LFE2-70SE-5FN900I – ECP2 Field Programmable Gate Array (FPGA) IC, 900-BBGA
The LFE2-70SE-5FN900I is an ECP2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It integrates a large programmable fabric with support for high I/O counts and embedded memory, packaged in a 900-ball FBGA (31×31) suitable for surface-mount assembly.
With 68,000 logic elements, approximately 1.06 Mbits of embedded memory, and 583 I/O pins, this industrial-grade device is built for designs requiring substantial logic density, high pin count, and extended operating temperature capability.
Key Features
- Core Logic 68,000 logic elements provide significant programmable logic capacity for medium- to large-scale designs.
- Embedded Memory Approximately 1.06 Mbits of on-chip RAM for buffering, state storage, and data processing functions.
- I/O Density 583 I/O pins enable extensive external interfacing for high-connectivity applications.
- Power Core supply range of 1.14 V to 1.26 V supports low-voltage operation consistent with modern FPGA fabric requirements.
- Package 900-ball FPBGA (31×31) package designed for surface-mount mounting, delivering a high-density footprint for board-level integration.
- Temperature and Grade Industrial operating range from −40 °C to 100 °C and RoHS compliance for use in temperature-challenging environments.
Unique Advantages
- High logic capacity: 68,000 logic elements allow implementation of complex logic functions and moderate system consolidation.
- Substantial on-chip memory: Approximately 1.06 Mbits of embedded RAM reduces dependence on external memory for many buffering and processing tasks.
- Extensive I/O availability: 583 I/O pins support multiple interfaces and parallel connectivity without extensive external multiplexing.
- Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in harsher environments.
- Compact, high-density package: 900-FPBGA (31×31) enables a compact board layout while maintaining high pin count and signal routing options.
- Low-voltage core operation: 1.14 V to 1.26 V supply range aligns with low-voltage system designs for power-sensitive applications.
Why Choose LFE2-70SE-5FN900I?
The LFE2-70SE-5FN900I combines substantial logic resources, on-chip memory, and a very high I/O count in a single industrial-grade 900-BBGA package. These characteristics make it well-suited for designs that require consolidated logic, extensive external connectivity, and operation across an extended temperature range.
This device is appropriate for engineering teams targeting robust, high-density FPGA implementations where board space, I/O count, and thermal resilience are key considerations. Its combination of integration and specified operating parameters supports scalable designs with predictable supply-chain and compliance attributes.
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