LFE2-70SE-5FN900I

IC FPGA 583 I/O 900FBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 583 1056768 68000 900-BBGA

Quantity 670 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package900-FPBGA (31x31)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case900-BBGANumber of I/O583Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8500Number of Logic Elements/Cells68000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1056768

Overview of LFE2-70SE-5FN900I – ECP2 Field Programmable Gate Array (FPGA) IC, 900-BBGA

The LFE2-70SE-5FN900I is an ECP2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It integrates a large programmable fabric with support for high I/O counts and embedded memory, packaged in a 900-ball FBGA (31×31) suitable for surface-mount assembly.

With 68,000 logic elements, approximately 1.06 Mbits of embedded memory, and 583 I/O pins, this industrial-grade device is built for designs requiring substantial logic density, high pin count, and extended operating temperature capability.

Key Features

  • Core Logic 68,000 logic elements provide significant programmable logic capacity for medium- to large-scale designs.
  • Embedded Memory Approximately 1.06 Mbits of on-chip RAM for buffering, state storage, and data processing functions.
  • I/O Density 583 I/O pins enable extensive external interfacing for high-connectivity applications.
  • Power Core supply range of 1.14 V to 1.26 V supports low-voltage operation consistent with modern FPGA fabric requirements.
  • Package 900-ball FPBGA (31×31) package designed for surface-mount mounting, delivering a high-density footprint for board-level integration.
  • Temperature and Grade Industrial operating range from −40 °C to 100 °C and RoHS compliance for use in temperature-challenging environments.

Unique Advantages

  • High logic capacity: 68,000 logic elements allow implementation of complex logic functions and moderate system consolidation.
  • Substantial on-chip memory: Approximately 1.06 Mbits of embedded RAM reduces dependence on external memory for many buffering and processing tasks.
  • Extensive I/O availability: 583 I/O pins support multiple interfaces and parallel connectivity without extensive external multiplexing.
  • Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in harsher environments.
  • Compact, high-density package: 900-FPBGA (31×31) enables a compact board layout while maintaining high pin count and signal routing options.
  • Low-voltage core operation: 1.14 V to 1.26 V supply range aligns with low-voltage system designs for power-sensitive applications.

Why Choose LFE2-70SE-5FN900I?

The LFE2-70SE-5FN900I combines substantial logic resources, on-chip memory, and a very high I/O count in a single industrial-grade 900-BBGA package. These characteristics make it well-suited for designs that require consolidated logic, extensive external connectivity, and operation across an extended temperature range.

This device is appropriate for engineering teams targeting robust, high-density FPGA implementations where board space, I/O count, and thermal resilience are key considerations. Its combination of integration and specified operating parameters supports scalable designs with predictable supply-chain and compliance attributes.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for LFE2-70SE-5FN900I.

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