LFE2-70SE-6F900I

The LFE2-70SE-6F900I is a Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for applications that require large programmable logic capacity and significant on-chip memory. It integrates approximately 68,000 logic elements and about 1.06 Mbits of embedded memory in a high-density 900-BBGA package.

With 583 I/O pins, a low-voltage core supply range of 1.14 V to 1.26 V, and an industrial operating temperature range of −40 °C to 100 °C, this device targets systems that need high I/O density, configurable logic, and robust environmental performance.

Key Features

• Core Logic  Approximately 68,000 logic elements provide substantial programmable logic capacity for complex digital designs.
• Embedded Memory  Total on-chip RAM of 1,056,768 bits (approximately 1.06 Mbits) for buffering, state storage, and application-specific memory needs.
• High I/O Count  583 I/O pins support extensive peripheral connectivity and parallel interfacing for dense system integration.
• Low-Voltage Core  Core voltage supply range of 1.14 V to 1.26 V to match low-voltage power domains in modern system designs.
• Industrial Temperature Range  Qualified for operation from −40 °C to 100 °C, suitable for deployments in challenging thermal environments.
• Package and Mounting  900-ball BGA (900-BBGA / supplier package 900-FPBGA, 31 × 31 mm) in a surface-mount form factor for compact, high-density PCB layouts.
• Grade and Compliance  Listed as Industrial grade and RoHS compliant for regulatory and environmental considerations.

Typical Applications

• Industrial Automation  High I/O count and industrial temperature rating make the device suitable for control logic, I/O aggregation, and real-time interfacing in automation equipment.
• Communications Infrastructure  Large logic capacity and abundant I/O support protocol processing, data plane functions, and custom packet-handling logic.
• High-density Embedded Systems  The combination of 68,000 logic elements and approximately 1.06 Mbits of on-chip RAM enables compact, feature-rich embedded designs that require configurable hardware acceleration.

Unique Advantages

• Significant Logic Capacity: Approximately 68,000 logic elements allow designers to implement complex digital functions and consolidate discrete components.
• Ample Embedded Memory: About 1.06 Mbits of on-chip RAM reduces dependency on external memory for many buffering and storage tasks.
• Very High I/O Count: 583 I/O pins enable broad connectivity options for sensors, interfaces, and parallel peripherals, simplifying system routing.
• Industrial Robustness: Rated for −40 °C to 100 °C operation and supplied in a surface-mount 900-BBGA package for reliable deployment in demanding environments.
• Low-voltage Core Compatibility: Narrow core voltage range (1.14 V to 1.26 V) helps integrate the FPGA into modern low-voltage power architectures.

Why Choose LFE2-70SE-6F900I?

The LFE2-70SE-6F900I positions itself as a high-capacity, industrial-grade FPGA option where large programmable logic, significant embedded memory, and extensive I/O are required. Its high-density 900-BBGA package and surface-mount mounting support compact board designs while the industrial temperature range and RoHS compliance address environmental and regulatory needs.

This device is well suited for engineering teams building complex embedded systems, communications equipment, or industrial automation solutions that demand configurable hardware, broad interfacing, and reliable operation across a wide temperature range.

Request a quote or submit an inquiry to receive pricing and availability information for the LFE2-70SE-6F900I. Our team can provide the next steps for procurement and technical evaluation.