LFE2-70SE-6FN900I

The LFE2-70SE-6FN900I is an ECP2 field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation, delivered in a 900‑ball BGA package. It provides a high-density programmable logic fabric with substantial embedded memory and a large number of I/O pins for systems requiring configurable logic and extensive connectivity.

Key attributes include 68,000 logic elements, approximately 1.06 Mbits of on‑chip RAM, and 583 I/O, all in a surface‑mount 900‑BBGA (900‑FPBGA, 31 × 31 mm) package. The device operates from 1.14 V to 1.26 V and is specified for industrial temperature operation.

Key Features

• Core Logic  68,000 logic elements provide a flexible programmable fabric suitable for complex logic integration and implementation of custom processing functions.
• Embedded Memory  Approximately 1.06 Mbits of on‑chip RAM for data buffering, state storage, and memory‑intensive logic functions.
• I/O Capacity  583 I/O pins enable extensive peripheral and subsystem connectivity without external expanders.
• Package & Mounting  900‑BBGA (supplier package: 900‑FPBGA, 31 × 31 mm) in a surface‑mount format for compact, high‑density board designs.
• Power  Core supply voltage range of 1.14 V to 1.26 V to match system power rails and support consistent operation.
• Temperature & Grade  Industrial grade device rated for operation from −40 °C to 100 °C, suitable for demanding environmental conditions.
• Compliance  RoHS compliant, meeting common regulatory requirements for lead‑free assembly.

Typical Applications

• High‑density I/O systems  Use the 583 I/O to interface with many sensors, peripherals, or communication channels without additional I/O expansion.
• Embedded logic acceleration  Deploy the 68,000 logic elements and on‑chip memory to implement custom datapaths, protocol handling, and hardware accelerators.
• Industrial automation  Industrial grade temperature range and robust packaging make the device suitable for control systems and factory automation equipment.
• Compact system integration  The 900‑BBGA surface‑mount package supports high‑density PCB designs where board space and connector count are constrained.

Unique Advantages

• High logic density: 68,000 logic elements enable consolidation of multiple discrete functions into a single programmable device, reducing BOM complexity.
• Substantial embedded RAM: Approximately 1.06 Mbits of on‑chip memory supports buffering and stateful logic without external memory components.
• Extensive I/O: 583 I/O pins simplify system partitioning and provide direct connectivity to a wide range of peripherals and interfaces.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C supports deployment in temperature‑challenging environments.
• Compact BGA packaging: 900‑BBGA (900‑FPBGA, 31 × 31 mm) enables dense board layouts while maintaining robust soldered connections for production assembly.
• RoHS compliant: Meets lead‑free requirements for modern electronics manufacturing and regulatory compliance.

Why Choose LFE2-70SE-6FN900I?

The LFE2-70SE-6FN900I delivers a balanced combination of logic capacity, on‑chip memory, and extensive I/O in a compact BGA package, making it well suited for designs that require integration of multiple functions into a single programmable device. Its industrial temperature rating and RoHS compliance provide confidence for deployments in demanding environments and modern manufacturing flows.

This FPGA is a practical choice for engineering teams seeking to consolidate logic, support complex interfacing, and maintain a compact PCB footprint while relying on quantifiable device specifications for power, thermal range, and packaging.

Request a quote or submit a price inquiry to obtain availability, lead time, and volume pricing for the LFE2-70SE-6FN900I to move your design forward.