LFE2-70SE-7F900C

The LFE2-70SE-7F900C is an ECP2 family field programmable gate array (FPGA) from Lattice Semiconductor Corporation, offered in a 900-ball BGA package. It provides a combination of high logic capacity, on-chip memory and a large number of I/O for commercial embedded designs.

With 68,000 logic elements, approximately 1.06 Mbits of embedded memory and up to 583 I/O, this device supports designs that require substantial programmable logic resources and dense external interfacing within a surface-mount 900-FPBGA (31×31) footprint.

Key Features

• Core Logic Capacity  68,000 logic elements for implementing complex digital functions and custom logic.
• Embedded Memory  Approximately 1.06 Mbits of on-chip RAM to support buffers, FIFOs and local data storage.
• I/O Density  Up to 583 I/O pins to accommodate multiple high-pin-count interfaces and parallel connections.
• Package and Mounting  Packaged in a 900-BBGA / 900-FPBGA (31×31) surface-mount device for compact, high-density PCB integration.
• Power Supply  Operates from a core supply range of 1.14 V to 1.26 V, enabling defined power planning for the FPGA core.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation to meet typical commercial-environment requirements.
• Regulatory Compliance  RoHS compliant, supporting lead-free assembly and regulatory needs.

Typical Applications

• High-density I/O systems  Ideal for designs that require many external connections—up to 583 I/O pins support interface-rich applications.
• Memory-dependent logic  Embedded memory (≈1.06 Mbits) enables local buffering and data handling for streaming or packetized data paths.
• Complex digital functions  68,000 logic elements allow implementation of sizeable custom logic, protocol engines and signal-processing blocks.
• Compact board-level integration  The 900-ball BGA (31×31) package supports high-density PCB layouts for space-constrained commercial equipment.

Unique Advantages

• High logic capacity: 68,000 logic elements provide the resource headroom needed for complex designs without immediate upsizing.
• Substantial embedded memory: Approximately 1.06 Mbits of on-chip RAM reduces external memory dependency and simplifies board design.
• Exceptional I/O count: Up to 583 I/O pins enable multi-interface designs and parallel data paths on a single device.
• Compact BGA packaging: 900-FPBGA (31×31) enables dense PCB implementation while maintaining robust signal pinout options.
• Designed for commercial deployments: 0 °C to 85 °C rating and RoHS compliance align with standard commercial manufacturing and environmental requirements.
• Defined core power envelope: 1.14 V–1.26 V supply range simplifies power architecture planning for the FPGA core.

Why Choose LFE2-70SE-7F900C?

The LFE2-70SE-7F900C pairs substantial programmable logic (68,000 logic elements) with significant embedded memory and a very high I/O count, all in a compact 900-ball BGA package. This combination makes it well suited for commercial designs that demand high integration, dense external interfacing and on-chip data storage.

For engineers and procurement teams seeking an FPGA that balances logic capacity, memory and I/O density while meeting commercial temperature and RoHS requirements, the LFE2-70SE-7F900C delivers a clear, verifiable specification set to support scalable, reliable system designs.

Request a quote or submit your project requirements to receive pricing and availability information for the LFE2-70SE-7F900C.