LFE2M100E-5F900I
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 416 5435392 95000 900-BBGA |
|---|---|
| Quantity | 649 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 900-FPBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 900-BBGA | Number of I/O | 416 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11875 | Number of Logic Elements/Cells | 95000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5435392 |
Overview of LFE2M100E-5F900I – ECP2M Field Programmable Gate Array (FPGA) IC 416 5435392 95000 900-BBGA
The LFE2M100E-5F900I is an ECP2M family Field Programmable Gate Array (FPGA) in a 900-ball BGA package, supplied in a surface-mount format. It provides a combination of high logic capacity, substantial on-chip memory, and a large number of I/O pins suitable for industrial-grade embedded designs.
Key device attributes include 95,000 logic elements, approximately 5.44 Mbits of embedded RAM, 416 I/O, and an operating range from -40 °C to 100 °C, with a nominal supply range of 1.14 V to 1.26 V.
Key Features
- Core Logic Up to 95,000 logic elements for implementing complex combinational and sequential logic.
- Configurable Logic Blocks (CLBs) 11,875 CLBs to structure and organize programmable logic resources efficiently.
- Embedded Memory Approximately 5.44 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
- I/O Capacity 416 I/O pins to interface with multiple peripherals, sensors, and external logic networks.
- Power Specified supply voltage range of 1.14 V to 1.26 V for core operation.
- Package and Mounting 900-ball BGA package (900-FPBGA, 31 × 31) in a surface-mount form factor for high-density PCB integration.
- Industrial Temperature Rating Rated for operation from -40 °C to 100 °C, suitable for industrial environments.
- Environmental Compliance RoHS compliant construction.
Unique Advantages
- High logic capacity: 95,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level parts count.
- Significant on-chip RAM: Approximately 5.44 Mbits of embedded memory supports local data handling and lowers dependence on external memory components.
- Large I/O complement: 416 I/O pins provide direct connectivity to diverse peripherals and system interfaces, simplifying board routing and design partitioning.
- Industrial operation: -40 °C to 100 °C rating supports deployment in demanding environmental conditions.
- Compact, high-density packaging: 900-ball FPBGA (31 × 31) supports space-constrained designs while enabling high pin count and signal density.
- Low core voltage: 1.14 V to 1.26 V supply range assists in power budgeting for energy-conscious systems.
Why Choose LFE2M100E-5F900I?
The LFE2M100E-5F900I is positioned for embedded and industrial designs that require substantial programmable logic, ample embedded memory, and a high I/O count in a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for long-life, deployed systems where environmental robustness and regulatory compliance matter.
Choose this FPGA when you need to integrate complex digital functions, reduce external component count, and maintain a small board footprint while operating across a wide temperature range and standard low-voltage core supply.
Request a quote or submit a pricing request to get detailed availability and lead-time information for the LFE2M100E-5F900I.
