LFE2-70SE-7FN672C

The LFE2-70SE-7FN672C is an ECP2 Field Programmable Gate Array (FPGA) in a 672-ball BGA package targeted at commercial-grade applications. It provides a balance of programmable logic capacity, on-chip memory, and high I/O count for designs that require flexible hardware acceleration and system integration.

Built to operate within a 1.14 V to 1.26 V core supply range and a 0 °C to 85 °C commercial temperature range, this surface-mount device is suited to a wide range of commercial embedded systems where programmable logic, moderate embedded memory, and extensive I/O are required.

Key Features

• Core Logic  Contains 68,000 logic elements providing substantial programmable fabric for glue logic, state machines, and custom accelerators.
• Logic Structure  Design resources enable mid-range integration of custom logic functions for commercial applications.
• Embedded Memory  Approximately 1.06 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage without external memory.
• I/O Capacity  Up to 500 I/O pins to support broad peripheral connectivity and parallel interfaces directly on-chip.
• Power  Core supply range from 1.14 V to 1.26 V for device operation within defined voltage limits.
• Package and Mounting  672-ball BGA (672-FPBGA, 27×27) surface-mount package for compact board-level integration and robust signal routing.
• Operating Range  Commercial-grade operation from 0 °C to 85 °C to meet typical commercial environment requirements.
• Regulatory  RoHS compliant, supporting lead‑free manufacturing processes.

Typical Applications

• Commercial Embedded Systems  Provides programmable logic and embedded memory capacity for custom control and data processing in commercial products.
• High I/O Interfaces  Suited to applications that require many external connections—up to 500 I/O pins—such as instrument front-ends or I/O-dense controllers.
• On‑chip Data Handling  The embedded ~1.06 Mbits of RAM supports local buffering, FIFOs, and small data stores for real-time processing tasks.
• Logic Integration and Glue  Ideal for consolidating glue logic and custom finite-state machines into a single programmable device to reduce board complexity.

Unique Advantages

• Substantial Logic Capacity: 68,000 logic elements enable integration of complex custom logic without immediately requiring larger devices.
• High I/O Count: 500 available I/Os allow direct interfacing to a wide variety of peripherals and parallel buses.
• On‑Chip Memory: Approximately 1.06 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Compact BGA Package: 672-ball, 27×27 FPBGA package supports dense board layouts while providing robust signal routing.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to match common commercial deployment environments.
• RoHS Compliant: Supports lead‑free manufacturing and assembly requirements.

Why Choose LFE2-70SE-7FN672C?

The LFE2-70SE-7FN672C offers a balanced mix of logic capacity, embedded memory, and extensive I/O in a compact 672-ball BGA form factor for commercial designs. Its specifications make it a practical choice for engineers needing sizable programmable fabric and local RAM to implement custom logic, buffering, and interface functions without upscaling to larger device families.

This device is well suited to teams developing commercial embedded equipment that value integration, flexibility, and a device footprint that supports dense PCB designs. The combination of 68,000 logic elements, approximately 1.06 Mbits of on-chip RAM, and 500 I/O pins delivers scalable capability while aligning with standard commercial temperature and RoHS manufacturing requirements.

Request a quote or submit a purchase inquiry today to evaluate how the LFE2-70SE-7FN672C can fit into your next commercial FPGA design.