LFE2-70SE-7F672C

The LFE2-70SE-7F672C is an ECP2 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation designed for commercial electronic applications. It delivers high logic capacity and embedded memory in a compact 672‑ball BGA package, supporting dense logic and multi‑I/O designs.

With 68,000 logic elements, approximately 1.056768 Mbits of on‑chip RAM and up to 500 I/O pins, this device targets designs that require substantial integration, flexible I/O connectivity and compact board‑level implementation while operating within standard commercial temperature and supply ranges.

Key Features

• Core Logic 68,000 logic elements to implement complex digital functions and custom logic architectures.
• Embedded Memory Approximately 1.056768 Mbits of on‑chip RAM for buffering, state storage and local data processing.
• I/O Capacity Up to 500 I/O pins to support wide parallel interfaces, multi‑channel connectivity and flexible board routing.
• Power Supply Operates from a core supply voltage range of 1.14 V to 1.26 V for compatibility with low‑voltage system domains.
• Package and Mounting 672‑BBGA (supplier package: 672‑FPBGA, 27×27 mm) surface‑mount package for compact, high‑density PCB integration.
• Temperature and Grade Commercial grade operation from 0 °C to 85 °C suitable for general‑purpose electronic products.
• Regulatory RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• High‑density digital processing — Implement complex logic functions and protocol processing using 68,000 logic elements and embedded RAM.
• Multi‑I/O interface hubs — Support parallel and multi‑channel interfaces with up to 500 general‑purpose I/Os.
• Compact embedded systems — Integrate into space‑constrained PCBs using the 672‑BBGA (27×27 mm) surface‑mount package.
• Commercial electronic equipment — Designed for use in commercial temperature environments (0 °C to 85 °C) and standard production flows.

Unique Advantages

• High logic capacity: 68,000 logic elements enable implementation of sizeable custom functions without external glue logic.
• Substantial on‑chip memory: Approximately 1.056768 Mbits of embedded RAM reduces reliance on external memory for many buffering and state‑storage tasks.
• Extensive I/O connectivity: Up to 500 I/O pins provide flexibility for interfacing with sensors, peripherals and parallel buses.
• Compact BGA footprint: 672‑ball FPBGA (27×27 mm) allows dense PCB routing and board‑level integration while keeping form factor small.
• Low‑voltage core operation: 1.14 V to 1.26 V supply range supports integration with modern low‑power system domains.
• RoHS compliant: Meets RoHS requirements for lead‑free manufacturing and broader supply chain compatibility.

Why Choose LFE2-70SE-7F672C?

The LFE2-70SE-7F672C positions itself as a high‑capacity, commercially graded FPGA optimized for designs that need large logic density, significant on‑chip memory and broad I/O in a compact BGA package. Its combination of 68,000 logic elements, approximately 1.056768 Mbits of RAM and up to 500 I/Os makes it suitable for embedded systems and multi‑interface applications where integration and board space are priorities.

For design teams and procurement focused on scalable, reliable commercial electronics, this ECP2 device provides a balance of integration, connectivity and manufacturing compatibility backed by Lattice Semiconductor Corporation's product family and documentation.

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