LFE2-70SE-7FN900C

The LFE2-70SE-7FN900C is a field programmable gate array (FPGA) device from Lattice Semiconductor designed for commercial-grade programmable logic applications. It combines a high logic element count with substantial on-chip RAM and a very high I/O count, making it suitable for designs that require dense logic, memory buffering, and extensive external interfacing.

Key hardware characteristics include 68,000 logic elements, approximately 1.06 Mbits of embedded memory, and 583 user I/Os in a 900-ball BGA footprint. The device operates with a core voltage range of 1.14 V to 1.26 V and is rated for commercial operating temperatures (0 °C to 85 °C).

Key Features

• Core Logic — 68,000 logic elements provide a high capacity for implementing complex programmable logic and custom digital functions.
• Embedded Memory — Approximately 1.06 Mbits of on-chip RAM for data buffering, state storage, and on-chip table lookups.
• High I/O Density — 583 user I/Os to support extensive external connectivity, parallel interfaces, and multi-channel peripherals.
• Package & Mounting — Available in a 900-ball BGA (supplier package: 900-FPBGA, 31 × 31 mm) and intended for surface-mount PCB assembly.
• Power — Narrow core supply range of 1.14 V to 1.26 V to assist predictable power planning in system designs.
• Environmental & Grade — Commercial temperature grade (0 °C to 85 °C) and RoHS compliant.

Typical Applications

• High-density logic designs — Implement complex glue logic, custom state machines, and parallel processing pipelines using the device’s 68,000 logic elements.
• Memory-intensive functions — Use approximately 1.06 Mbits of embedded RAM for buffering, packet queues, and on-chip data structures.
• High I/O connectivity — Support multi-channel interfaces, sensor arrays, or broad peripheral sets with 583 available I/Os.
• Commercial embedded systems — Deploy in commercial-temperature systems requiring substantial programmable logic and I/O integration.

Unique Advantages

• High logic capacity: 68,000 logic elements enable implementation of large, complex designs without immediate need for external logic expansion.
• Significant on-chip RAM: Approximately 1.06 Mbits of embedded memory reduces external memory dependence for many buffering and state storage tasks.
• Extensive I/O resources: 583 I/Os simplify board-level interfacing and reduce the need for external I/O expanders.
• Compact BGA footprint: 900-ball BGA (900-FPBGA, 31 × 31 mm) balances high integration density with a standardized surface-mount package.
• Predictable power planning: A defined core voltage window (1.14 V–1.26 V) helps streamline power-supply design and system integration.
• RoHS compliant: Conforms to RoHS requirements for material compliance in commercial electronic products.

Why Choose LFE2-70SE-7FN900C?

The LFE2-70SE-7FN900C positions itself as a balanced commercial-grade FPGA offering a mix of high logic density, substantial embedded memory, and very high I/O count in a compact BGA package. These characteristics make it well suited to commercial embedded systems where integration, board-level interface capacity, and on-chip memory are priorities.

Design teams seeking a programmable-logic device with 68,000 logic elements, approximately 1.06 Mbits of RAM, and 583 I/Os will find this device a capable option for consolidating functions, simplifying board architecture, and supporting scalable designs within a commercial temperature range.

Request a quote or submit an inquiry to obtain pricing and availability information for the LFE2-70SE-7FN900C.