LFE2M100E-5FN1152C

The LFE2M100E-5FN1152C is an ECP2M family field programmable gate array (FPGA) in a 1152-ball BGA package, offering a high-density programmable logic solution for commercial-grade systems. It combines 95,000 logic elements with approximately 5.44 Mbits of embedded memory and 520 I/O pins to support complex logic integration and flexible interfacing.

Designed for surface-mount assembly and RoHS compliance, this device operates from a 1.14 V to 1.26 V supply and is specified for commercial operating temperatures (0 °C to 85 °C), providing predictable electrical and thermal characteristics for a range of board-level implementations.

Key Features

• Core Capacity  95,000 logic elements provide substantial programmable logic resources for complex digital designs and custom hardware functions.
• Embedded Memory  Approximately 5.44 Mbits of on-chip RAM supports buffering, FIFOs, and memory-intensive logic without immediate need for external memory.
• I/O Density  520 I/O pins enable broad external connectivity and interface options on a single device, simplifying multi-signal designs.
• Power Supply  Operates from a 1.14 V to 1.26 V core supply, allowing precise power budgeting and integration with system power rails.
• Package and Mounting  1152-BBGA (supplier package: 1152-FPBGA, 35×35 mm) in a surface-mount format delivers a compact, high-pin-count solution for dense PCB layouts.
• Operating Grade and Temperature  Commercial grade device specified for 0 °C to 85 °C operation for typical commercial environments.
• Regulatory  RoHS-compliant construction supports modern environmental and manufacturing requirements.

Unique Advantages

• High logic density: 95,000 logic elements enable integration of multiple functions onto a single FPGA, reducing component count and PCB complexity.
• Substantial on‑chip memory: Approximately 5.44 Mbits of embedded RAM minimizes reliance on external memory for many buffering and storage needs, improving system latency and simplifying BOM.
• Extensive I/O: 520 I/Os allow consolidation of diverse interfaces and sensors to a single device, streamlining board routing and connector requirements.
• Compact, high‑pin package: The 1152‑ball BGA (35×35 mm) balances high pin count with a space-efficient footprint for dense board designs.
• Commercial-grade specification: Specified for 0 °C to 85 °C operation and RoHS compliance for reliable performance in standard commercial environments.
• Controlled core voltage: Narrow 1.14 V–1.26 V supply range supports predictable power design and simplifies voltage regulation choices.

Why Choose LFE2M100E-5FN1152C?

The LFE2M100E-5FN1152C positions itself as a high-capacity, commercially graded FPGA that brings significant logic and memory resources together with a large I/O complement in a space-efficient BGA package. Its combination of 95,000 logic elements and approximately 5.44 Mbits of embedded RAM is suited to designs that require high integration and flexible interfacing without proliferating external components.

Engineers and procurement teams seeking a RoHS-compliant, surface-mount FPGA with a clearly defined operating voltage range and commercial temperature rating will find this device appropriate for scalable digital designs where predictable electrical characteristics and dense connectivity matter.

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