LFE2M100E-6F900C

The LFE2M100E-6F900C from Lattice Semiconductor Corporation is an ECP2M family field programmable gate array (FPGA) in a 900-ball FBGA package (31 × 31 mm). It delivers a high-density, programmable fabric suitable for system integration tasks that require substantial logic, on-chip memory, and high-speed serial connectivity.

Designed for communications, networking and embedded processing applications, the device combines large logic capacity and embedded memory with family-level features such as high-speed SERDES, sysDSP blocks and flexible I/O standards to address data-path, protocol and signal-processing functions.

Key Features

• Logic Capacity — 95,000 logic elements for complex digital designs and integration of multiple functions on a single device.
• Embedded Memory — Approximately 5.44 Mbits of on-chip RAM (5,435,392 bits) to support large data buffers, FIFOs and local storage.
• I/O and Package — 416 user I/Os in a 900‑BBGA (900‑FPBGA, 31 × 31 mm) surface-mount package for high pin-count system interfaces.
• Power — Core supply range 1.14 V to 1.26 V to match system power domains and planning.
• Operating Range & Grade — Commercial grade, rated for 0 °C to 85 °C operating temperature; RoHS compliant.
• Embedded SERDES (ECP2M family) — Family-level SERDES support with data rates from 250 Mbps to 3.125 Gbps and up to 16 channels per device for high-speed serial protocols including PCI Express, Ethernet (1GbE, SGMII), OBSAI, CPRI and Serial RapidIO.
• sysDSP Blocks — Family-level sysDSP resources for high-performance multiply–accumulate operations; each block supports multiple multiplier configurations to accelerate signal processing tasks.
• Clocking Resources — Family-level sysCLOCK analog PLLs and DLLs (including GPLLs and SPLLs) for on-chip clock multiplication, division and phase/delay adjustment.
• Programmable I/O Standards — Family-level support for a wide range of I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, RSDS, MLVDS, LVPECL and others) to interface with diverse peripherals and memory types.

Typical Applications

• Communications Equipment — Implements high-speed transport and fronthaul/backhaul interfaces using embedded SERDES for protocols such as CPRI, OBSAI and Serial RapidIO.
• Networking & Ethernet — Supports 1GbE and SGMII links and protocol handling with on-chip logic, memory and SERDES connectivity.
• High‑Performance Embedded Systems — Accelerates DSP and data-path processing using sysDSP blocks and substantial embedded RAM for buffering and staging.
• Protocol Bridging and Interface Gateways — Large I/O count and flexible I/O standards enable bridging between legacy and high-speed serial interfaces in compact system designs.

Unique Advantages

• High logic density: 95,000 logic elements let you consolidate multiple subsystems into a single FPGA to reduce board-level component count.
• Substantial on-chip RAM: Approximately 5.44 Mbits of embedded memory supports large FIFO buffers, packet buffering and local data storage without external RAM.
• High-speed serial capability: Family-level SERDES (250 Mbps–3.125 Gbps) and protocol support enable robust link implementation for communications and networking equipment.
• Flexible interfacing: 416 I/Os and broad programmable I/O standards simplify integration with diverse peripherals, memory types and signaling levels.
• Commercial deployment ready: Surface-mount 900‑BBGA package, commercial temperature range (0 °C–85 °C) and RoHS compliance support standard production environments.
• Design ecosystem support: Part of the Lattice ECP2M family with documented device features and design flows suitable for engineering teams targeting mid-to-high density FPGA applications.

Why Choose LFE2M100E-6F900C?

The LFE2M100E-6F900C offers a balanced combination of high logic density, significant embedded memory and family-level high-speed SERDES and DSP resources, making it well suited for communications, networking and embedded processing designs that require on-chip integration and high throughput. Its 900‑BBGA package and 416 I/Os provide the pin count and signal density needed for complex board-level interfacing.

For design teams needing a commercially graded FPGA solution with proven family capabilities—large logic capacity, multi-megabit embedded RAM, flexible I/O and SERDES support—the LFE2M100E-6F900C delivers the core resources required to shorten system BOMs and consolidate functionality onto a single programmable device.

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