LFE2M100E-6FN1152I

IC FPGA 520 I/O 1152FBGA
Part Description

ECP2M Field Programmable Gate Array (FPGA) IC 520 5435392 95000 1152-BBGA

Quantity 918 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FPBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGANumber of I/O520Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11875Number of Logic Elements/Cells95000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5435392

Overview of LFE2M100E-6FN1152I – ECP2M FPGA, 95k logic elements, 1152-BBGA

The LFE2M100E-6FN1152I is an industrial-grade Lattice ECP2M family Field Programmable Gate Array (FPGA) supplied in a 1152-ball BBGA package. It integrates high logic density, extensive embedded memory and a large I/O count to support complex system designs in communications, industrial and high-performance embedded applications.

Designed for designers requiring compact, surface-mount FPGA solutions, this device offers 95,000 logic elements, approximately 5.44 Mbits of embedded memory and 520 I/Os, alongside family-level features such as high-speed SERDES, DSP resources and flexible clocking.

Key Features

  • Logic Capacity  95,000 logic elements (LUT-based fabric) for implementing large FPGA designs and complex logic integration.
  • Embedded Memory  Approximately 5.44 Mbits of on-chip RAM (5,435,392 total RAM bits) to support large buffering, packet processing and local data storage.
  • High I/O Count  520 user I/Os to connect multiple peripherals, memory interfaces and board-level buses from a single device.
  • Package & Mounting  1152-BBGA / 1152-FPBGA (35 × 35 mm) surface-mount package for high-density board integration.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in demanding environments.
  • Low-Voltage Core  Core supply range 1.14 V to 1.26 V to match modern low-voltage power domains.
  • Family-Level SERDES  Lattice ECP2M family supports embedded SERDES with data rates from 250 Mbps to 3.125 Gbps and up to 16 channels per device (family feature).
  • Advanced DSP & Clocking (Family)  ECP2/M family includes sysDSP blocks, multiple PLLs and DLLs for high-performance multiply-accumulate and flexible clock management (family feature).
  • RoHS Compliant  Manufactured to meet RoHS requirements.

Typical Applications

  • Networking & Communications  High logic density, SERDES capabilities (family-level) and abundant I/O make this FPGA suitable for line cards, protocol bridging and packet processing.
  • Industrial Automation  Industrial temperature rating and large I/O count support real-time control, sensor aggregation and deterministic interface logic.
  • Embedded Processing  Substantial embedded memory and DSP resources (family-level) enable offload of compute-intensive algorithms and local buffering for embedded systems.
  • High-Density Board Designs  Compact 1152-BBGA package and surface-mount mounting support space-constrained, high-performance PCBs.

Unique Advantages

  • High Integration: Consolidates large amounts of logic (95k elements), memory and I/O in a single package to reduce BOM and board complexity.
  • Large On-Chip Memory: Approximately 5.44 Mbits of embedded RAM enables significant local storage for buffering, tables and data processing—reducing external memory requirements.
  • Extensive I/O Connectivity: 520 I/Os allow flexible partitioning of interfaces and support for multiple peripheral and memory connections without external multiplexing.
  • Industrial Reliability: −40 °C to 100 °C operating range and RoHS compliance make the device suitable for industrial deployments.
  • Scalable Performance (Family): ECP2M family features such as SERDES, sysDSP blocks and flexible clocking provide a clear upgrade path for designs requiring higher throughput or specialized interfaces.
  • Compact, High‑Density Package: 1152-ball FBGA (35 × 35 mm) supports dense routing and small form-factor system designs.

Why Choose LFE2M100E-6FN1152I?

This Lattice ECP2M device balances high logic capacity, substantial embedded memory and a large I/O complement in an industrial-grade, surface-mount BBGA package. It is well suited to engineers building complex communications, industrial control or embedded processing systems that require on-chip resources to minimize external components and streamline board-level design.

With family-level features such as high-speed SERDES channels, dedicated DSP blocks and flexible clock management, this FPGA offers a pathway to scalable system performance while maintaining a compact footprint and industrial operating range.

Request a quote or submit a purchase inquiry to receive pricing and lead-time information for the LFE2M100E-6FN1152I.

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