LFE2M100E-6FN1152I
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 520 5435392 95000 1152-BBGA |
|---|---|
| Quantity | 918 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Not For New Designs |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FPBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA | Number of I/O | 520 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11875 | Number of Logic Elements/Cells | 95000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5435392 |
Overview of LFE2M100E-6FN1152I – ECP2M FPGA, 95k logic elements, 1152-BBGA
The LFE2M100E-6FN1152I is an industrial-grade Lattice ECP2M family Field Programmable Gate Array (FPGA) supplied in a 1152-ball BBGA package. It integrates high logic density, extensive embedded memory and a large I/O count to support complex system designs in communications, industrial and high-performance embedded applications.
Designed for designers requiring compact, surface-mount FPGA solutions, this device offers 95,000 logic elements, approximately 5.44 Mbits of embedded memory and 520 I/Os, alongside family-level features such as high-speed SERDES, DSP resources and flexible clocking.
Key Features
- Logic Capacity 95,000 logic elements (LUT-based fabric) for implementing large FPGA designs and complex logic integration.
- Embedded Memory Approximately 5.44 Mbits of on-chip RAM (5,435,392 total RAM bits) to support large buffering, packet processing and local data storage.
- High I/O Count 520 user I/Os to connect multiple peripherals, memory interfaces and board-level buses from a single device.
- Package & Mounting 1152-BBGA / 1152-FPBGA (35 × 35 mm) surface-mount package for high-density board integration.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C for deployment in demanding environments.
- Low-Voltage Core Core supply range 1.14 V to 1.26 V to match modern low-voltage power domains.
- Family-Level SERDES Lattice ECP2M family supports embedded SERDES with data rates from 250 Mbps to 3.125 Gbps and up to 16 channels per device (family feature).
- Advanced DSP & Clocking (Family) ECP2/M family includes sysDSP blocks, multiple PLLs and DLLs for high-performance multiply-accumulate and flexible clock management (family feature).
- RoHS Compliant Manufactured to meet RoHS requirements.
Typical Applications
- Networking & Communications High logic density, SERDES capabilities (family-level) and abundant I/O make this FPGA suitable for line cards, protocol bridging and packet processing.
- Industrial Automation Industrial temperature rating and large I/O count support real-time control, sensor aggregation and deterministic interface logic.
- Embedded Processing Substantial embedded memory and DSP resources (family-level) enable offload of compute-intensive algorithms and local buffering for embedded systems.
- High-Density Board Designs Compact 1152-BBGA package and surface-mount mounting support space-constrained, high-performance PCBs.
Unique Advantages
- High Integration: Consolidates large amounts of logic (95k elements), memory and I/O in a single package to reduce BOM and board complexity.
- Large On-Chip Memory: Approximately 5.44 Mbits of embedded RAM enables significant local storage for buffering, tables and data processing—reducing external memory requirements.
- Extensive I/O Connectivity: 520 I/Os allow flexible partitioning of interfaces and support for multiple peripheral and memory connections without external multiplexing.
- Industrial Reliability: −40 °C to 100 °C operating range and RoHS compliance make the device suitable for industrial deployments.
- Scalable Performance (Family): ECP2M family features such as SERDES, sysDSP blocks and flexible clocking provide a clear upgrade path for designs requiring higher throughput or specialized interfaces.
- Compact, High‑Density Package: 1152-ball FBGA (35 × 35 mm) supports dense routing and small form-factor system designs.
Why Choose LFE2M100E-6FN1152I?
This Lattice ECP2M device balances high logic capacity, substantial embedded memory and a large I/O complement in an industrial-grade, surface-mount BBGA package. It is well suited to engineers building complex communications, industrial control or embedded processing systems that require on-chip resources to minimize external components and streamline board-level design.
With family-level features such as high-speed SERDES channels, dedicated DSP blocks and flexible clock management, this FPGA offers a pathway to scalable system performance while maintaining a compact footprint and industrial operating range.
Request a quote or submit a purchase inquiry to receive pricing and lead-time information for the LFE2M100E-6FN1152I.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
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