LFE2M100E-7F900C

IC FPGA 416 I/O 900FBGA
Part Description

ECP2M Field Programmable Gate Array (FPGA) IC 416 5435392 95000 900-BBGA

Quantity 1,123 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package900-FPBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case900-BBGANumber of I/O416Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11875Number of Logic Elements/Cells95000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5435392

Overview of LFE2M100E-7F900C – ECP2M FPGA, 95,000 Logic Elements, 900-BBGA

The LFE2M100E-7F900C is an ECP2M Field Programmable Gate Array (FPGA) IC designed for commercial embedded applications requiring substantial programmable logic, on-chip memory and dense I/O. It integrates 95,000 logic elements with approximately 5.4 Mbits of embedded memory to support complex logic and data buffering in a compact surface-mount package.

This device operates from a 1.14 V to 1.26 V supply and is specified for commercial temperature operation from 0 °C to 85 °C. The 900-BBGA package (900-FPBGA, 31 × 31) provides a high pin-count footprint with 416 I/O for broad system connectivity.

Key Features

  • Logic Capacity — Contains 95,000 logic elements to implement large-scale programmable logic functions and custom datapaths.
  • Embedded Memory — Approximately 5.4 Mbits of on-chip RAM for buffering, state storage and lookup table needs within the FPGA fabric.
  • I/O Density — 416 available I/O pins to support interfaces and external device connectivity without external multiplexing.
  • Power Supply — Supports a core voltage range of 1.14 V to 1.26 V to match system power architectures.
  • Package & Mounting — Supplied in a 900-BBGA (supplier package: 900-FPBGA, 31 × 31) surface-mount package for high-density PCB implementations.
  • Operating Range & Grade — Commercial-grade device rated for 0 °C to 85 °C operation.
  • RoHS Compliance — Manufactured in compliance with RoHS requirements.

Unique Advantages

  • High integration density: 95,000 logic elements and ~5.4 Mbits of embedded memory reduce the need for external logic and RAM, simplifying system BOMs.
  • Extensive I/O: 416 I/O pins enable direct connection to multiple peripherals and high-pin-count interfaces without additional expander chips.
  • Compact, high-pin-count package: The 900-BBGA (31 × 31) balances board area and connectivity for space-constrained, high-functionality designs.
  • Commercial temperature qualification: Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
  • Controlled core supply: Narrow core voltage range (1.14 V–1.26 V) facilitates predictable power-domain design and integration.
  • RoHS compliant: Aligns with environmental requirements for lead-free manufacturing.

Why Choose LFE2M100E-7F900C?

The LFE2M100E-7F900C positions itself as a high-capacity, memory-rich FPGA option for commercial embedded designs that demand dense logic, substantial on-chip RAM and broad I/O connectivity in a compact BGA package. Its specifications make it suitable for designs that prioritize integration density and on-chip resources while operating within commercial temperature limits.

For engineers and procurement teams seeking a programmable logic device with a clear set of verifiable specifications—logic capacity, embedded memory size, I/O count, package form factor, supply voltage and temperature rating—this FPGA provides a well-defined building block to scale and standardize designs.

If you would like pricing, availability or a formal quote for the LFE2M100E-7F900C, please submit a request or contact our sales team to initiate a quote.

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