LFE2M100SE-5F900C

The LFE2M100SE-5F900C is a commercial-grade Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation based on the ECP2M family. It provides high-density logic and I/O in a compact BGA package, addressing commercial embedded designs that require substantial on-chip memory, large I/O counts, and flexible logic capacity. Key hardware attributes include 95,000 logic elements, approximately 5.4 Mbits of embedded memory, and 416 I/O pins, delivered in a 900-ball BGA package.

Key Features

• Logic Resources  95,000 logic elements to implement complex custom logic and moderate-to-high-density designs.
• Embedded Memory  Approximately 5.4 Mbits of on-chip RAM for buffering, state storage, and memory-mapped functions.
• I/O Capacity  416 I/O pins to support broad external interfacing and multi-channel connectivity.
• Power Supply  Operates from a core voltage range of 1.14 V to 1.26 V.
• Package & Mounting  Surface-mount 900-BBGA package; supplier device package listed as 900-FPBGA (31×31), suitable for compact board layouts.
• Operating Range  Commercial temperature grade with an operating range of 0°C to 85°C.
• Environmental Compliance  RoHS compliant for lead-free manufacturing and environmental regulatory alignment.

Typical Applications

• Commercial Embedded Systems  Implements control, glue logic, and custom acceleration in commercial products that require substantial logic and memory resources.
• Multi‑I/O Interfaces  Designs needing high pin counts for parallel buses, I/O expansion, or protocol bridging can leverage the 416 I/O pins.
• On‑board Memory‑Intensive Functions  Use the approximately 5.4 Mbits of embedded RAM for packet buffering, FIFOs, and temporary data storage.
• Compact BGA Designs  The 900-ball BGA package fits space-constrained PCBs while enabling high-density integration.

Unique Advantages

• High Logic Capacity: 95,000 logic elements enable substantial on-chip logic integration, reducing the need for external glue components.
• Significant Embedded Memory: Approximately 5.4 Mbits of RAM supports data buffering and memory-hungry functions without external memory.
• Extensive I/O Count: 416 I/O pins provide flexibility for multi-channel interfaces and diverse peripheral connectivity.
• Compact, Surface‑Mount BGA: 900-BBGA / 900-FPBGA (31×31) packaging supports high-density board layouts and modern assembly processes.
• Commercial Operating Range: Rated for 0°C to 85°C, suitable for a wide range of commercial applications and environments.
• RoHS Compliant: Meets lead-free manufacturing requirements for environmentally conscious production.

Why Choose LFE2M100SE-5F900C?

The LFE2M100SE-5F900C balances high logic capacity, substantial on-chip memory, and a large I/O complement in a compact 900-ball BGA package, making it well suited for commercial embedded designs that require integrated, high-density programmable logic. Backed by Lattice Semiconductor Corporation, this FPGA targets designers who need a compact, RoHS-compliant device with clear electrical and thermal operating points (1.14 V–1.26 V core voltage, 0°C–85°C operating temperature).

Choose this part when your design calls for a commercial-grade FPGA offering tens of thousands of logic elements, multi-megabit embedded RAM, and extensive I/O while maintaining a compact board footprint.

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