LFE2M100E-7FN900C

The LFE2M100E-7FN900C is a commercial-grade Field Programmable Gate Array (FPGA) supplied in a 900-ball BGA package. It delivers a high logic capacity architecture with substantial embedded RAM and a large I/O count for complex, high-density digital designs.

Key value is provided through a combination of approximately 95,000 logic elements, roughly 5.44 Mbits of on-chip RAM, and up to 416 I/Os, all in a compact 900-BBGA (31×31) surface-mount package operating within a 1.14 V to 1.26 V supply range and 0 °C to 85 °C commercial temperature window.

Key Features

• Logic Capacity — Approximately 95,000 logic elements for implementing large-scale combinational and sequential logic.
• Embedded Memory — Approximately 5.44 Mbits of on-chip RAM to support data buffering, FIFOs, and state storage without external memory.
• I/O Resources — Up to 416 I/Os to interface with a wide range of peripherals and system buses.
• Package and Mounting — 900-BBGA / 900-FPBGA (31×31) surface-mount package suitable for space-efficient board integration.
• Power — Core voltage supply range of 1.14 V to 1.26 V for defined power planning.
• Operating Range — Commercial operating temperature range from 0 °C to 85 °C for standard commercial applications.
• Regulatory — RoHS compliant.

Unique Advantages

• High Logic Density: Approximately 95,000 logic elements enable consolidation of complex functions into a single device, reducing component count.
• Significant On-Chip Memory: Around 5.44 Mbits of embedded RAM supports larger buffering and local data storage to minimize external memory dependency.
• Extensive I/O Count: 416 available I/Os provide flexibility for multi-interface designs and high pin-count connectivity.
• Compact BGA Package: 900-ball FPBGA (31×31) allows high pin density in a compact footprint for space-constrained boards.
• Commercial Grade: Specified 0 °C to 85 °C operating range and RoHS compliance align with standard commercial product requirements.
• Defined Core Voltage: Narrow supply window (1.14 V–1.26 V) helps with precise power supply design and management.

Why Choose LFE2M100E-7FN900C?

This FPGA targets designers who require a high-capacity, high-I/O programmable device in a compact BGA package for commercial applications. Its combination of approximately 95,000 logic elements, sizable on-chip RAM, and 416 I/Os provides a balance of integration and flexibility for complex digital systems while simplifying board-level design through high integration.

With defined electrical and thermal operating points and RoHS compliance, the LFE2M100E-7FN900C is suitable for development and production programs that prioritize logic density, embedded memory capacity, and a high number of external interfaces within a commercial temperature envelope.

Request a quote or submit an inquiry to obtain pricing and availability for the LFE2M100E-7FN900C. Our team can provide lead-time information and support for volume planning and procurement.