LFE2M100SE-5F900I

The LFE2M100SE-5F900I is an ECP2M field programmable gate array (FPGA) from Lattice Semiconductor Corporation, delivered in a 900-ball BGA package. It provides a high logic density fabric with abundant I/O and embedded memory tailored for industrial applications requiring reconfigurable logic.

With 95,000 logic elements, approximately 5.43 Mbits of embedded memory and 416 I/O pins in a compact 900-FPBGA (31×31) footprint, this device targets designs that need substantial on-chip logic and interfacing capability within an industrial temperature range.

Key Features

• Core Logic 95,000 logic elements deliver a high level of programmable logic resources for implementing custom digital functions and accelerators.
• Embedded Memory Approximately 5.43 Mbits of on-chip RAM provide local storage for buffers, lookup tables, and state machines.
• I/O Capacity 416 I/O pins support large numbers of peripherals, sensors, and external interfaces for complex system integration.
• Package & Mounting Supplied in a 900-BBGA (900-FPBGA, 31×31) surface-mount package to enable dense board-level integration in space-constrained designs.
• Power Operates from a core voltage supply range of 1.14 V to 1.26 V, suitable for systems designed around low-voltage FPGA cores.
• Industrial Temperature Rated for operation from −40 °C to 100 °C and specified as industrial grade for use in demanding thermal environments.
• Regulatory Compliance RoHS compliant to support lead-free manufacturing and environmental requirements.

Typical Applications

• Industrial Control & Automation — Industrial-grade temperature range and robust logic capacity make this FPGA suitable for motor control, PLC expansions, and factory automation controllers.
• Embedded Processing & Custom Logic — Large logic element count and on-chip RAM enable implementation of custom accelerators, state machines, and glue logic for embedded systems.
• High-Density I/O Systems — 416 I/O pins support extensive sensor arrays, I/O expansion, and multi-channel interfacing in instrumentation and control panels.
• Communications & Networking — Flexible logic and memory resources can be applied to protocol handling, packet processing, and interface bridging within network equipment.

Unique Advantages

• High Logic Density: 95,000 logic elements provide room for complex designs without immediate need for external logic components, reducing BOM complexity.
• Substantial Embedded Memory: Approximately 5.43 Mbits of on-chip RAM enable local buffering and state storage, improving latency and system determinism.
• Extensive I/O Count: 416 I/O pins allow broad peripheral and sensor connectivity, simplifying board-level routing for multi-channel systems.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in harsh or temperature-variable environments.
• Compact, Surface-Mount Package: 900-FPBGA (31×31) package offers a high-pin-count solution in a compact footprint for space-constrained PCBs.
• RoHS Compliant: Conforms to lead-free manufacturing requirements for environmentally conscious production.

Why Choose LFE2M100SE-5F900I?

The LFE2M100SE-5F900I combines high logic capacity, significant embedded memory, and a large I/O complement in a compact 900-ball BGA package, positioning it for industrial embedded designs that require reconfigurable, high-density logic. Its specified core voltage range and industrial temperature rating make it suitable for systems that demand reliable operation across a wide set of environmental conditions.

Backed by Lattice Semiconductor Corporation, this FPGA is appropriate for engineers seeking a scalable, high-resource programmable device for industrial control, embedded processing, and complex interfacing tasks where on-chip logic and memory reduce external component count and simplify system design.

Request a quote or submit an RFQ for pricing and availability of the LFE2M100SE-5F900I to move your design forward.