LFE2M100SE-5FN900I

The LFE2M100SE-5FN900I is a Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation’s ECP2M family. It delivers a high logic capacity and substantial on-chip memory in a compact 900-ball BGA package for space-constrained, high-density designs.

Built for industrial applications, the device combines up to 95,000 logic elements, approximately 5.44 Mbits of embedded memory, and 416 I/Os while operating over a wide temperature range and low supply voltage to meet demanding embedded and control system requirements.

Key Features

• Core Logic 95,000 logic elements provide large-scale programmable logic resources for complex digital functions and custom hardware acceleration.
• Embedded Memory Approximately 5.44 Mbits of on-chip RAM to support buffering, packet processing, and local data storage without external memory.
• I/O Capacity 416 general-purpose I/Os enable high-channel count interfacing for sensors, peripherals, and parallel/high-density external buses.
• Power Supply Nominal supply range of 1.14 V to 1.26 V to match low-voltage system domains and minimize board-level power management complexity.
• Package & Mounting 900-ball BGA (900-FPBGA, 31×31) surface-mount package provides a compact footprint for high-pin-count applications.
• Industrial Temperature Range Rated for operation from −40°C to 100°C to support deployment in industrial and other temperature-demanding environments.
• RoHS Compliant Conforms to RoHS requirements for lead-free manufacturing and environmentally conscious designs.

Typical Applications

• Industrial Automation — Implement motor control, PLC logic, and sensor aggregation functions that require robust logic resources and industrial temperature tolerance.
• Embedded Systems — Integrate custom control logic and peripheral interfaces in compact boards where board space and I/O density are critical.
• High-Density I/O Systems — Support multi-channel data acquisition, parallel interfaces, and aggregation of numerous sensors or actuators using the 416 I/Os.
• Custom Logic Acceleration — Offload compute- or latency-sensitive tasks to on-device programmable logic using abundant logic elements and on-chip RAM.

Unique Advantages

• High Logic Capacity: 95,000 logic elements enable implementation of complex FPGA designs without immediate need for external logic expansion.
• Substantial On-Chip Memory: Approximately 5.44 Mbits of embedded RAM reduces dependence on external memory and simplifies board design.
• Large I/O Count: 416 I/Os provide flexibility for multi-channel interfaces and dense connectivity in constrained form factors.
• Compact, High-Pin Package: 900-ball FPBGA (31×31) balances pin count and PCB area for space-optimized assemblies.
• Industrial Temperature Rating: −40°C to 100°C operation supports deployments in harsh or variable-temperature environments.
• Low-Voltage Operation: 1.14 V to 1.26 V supply range aligns with modern low-voltage system domains to help manage overall power consumption.

Why Choose LFE2M100SE-5FN900I?

The LFE2M100SE-5FN900I positions itself as a high-capacity, industrial-grade FPGA option for designers needing extensive logic, substantial embedded memory, and a large I/O complement in a compact BGA package. Its combination of 95,000 logic elements, approximately 5.44 Mbits of RAM, and 416 I/Os makes it well suited to sophisticated embedded, control, and I/O-heavy designs where board area and environmental range matter.

Manufactured by Lattice Semiconductor Corporation and offered in a 900-ball FPBGA package, this device supports developers targeting robust, high-density implementations with RoHS-compliant manufacturing requirements.

Request a quote or submit an inquiry to obtain pricing and availability for the LFE2M100SE-5FN900I.