LFE2M100SE-6FN1152I

The LFE2M100SE-6FN1152I is an industrial-grade Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation’s ECP2M family. It delivers high logic density, substantial embedded memory, and a large I/O count in a compact surface-mount BGA package.

Key hardware characteristics include approximately 95,000 logic elements, roughly 5.43 Mbits of on-chip RAM, 520 I/O pins, a 1152-BBGA package (1152-FPBGA, 35×35), a core voltage range of 1.14 V to 1.26 V, and an operating temperature range of −40 °C to 100 °C. The device is RoHS compliant and specified for industrial use.

Key Features

• Logic Capacity  Approximately 95,000 logic elements for implementing complex digital functions and custom logic pipelines.
• Embedded Memory  Approximately 5.43 Mbits of on-chip RAM (5,435,392 bits) to support buffering, packet storage, and state retention without external memory.
• I/O Density  520 I/O pins to accommodate multiple high-density interfaces and parallel peripherals.
• Package & Mounting  1152-BBGA package (supplier device package: 1152-FPBGA, 35×35) designed for surface-mount assembly in compact system layouts.
• Power Supply  Core voltage supply range of 1.14 V to 1.26 V to match system power rails and designer requirements.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• Regulatory Compliance  RoHS compliant, supporting environmental and manufacturing requirements.

Typical Applications

• Industrial Control  Used in industrial automation and control systems where industrial-grade temperature range and reliable on-chip resources are required.
• High-Density I/O Systems  Ideal for designs that require many external interfaces or parallel connections, leveraging the 520 I/O pins for sensors, buses, and peripherals.
• Memory-Intensive Logic  Suitable for applications that need significant on-chip buffering or packet storage, taking advantage of approximately 5.43 Mbits of embedded RAM.
• Compact Board Designs  The 1152-BBGA surface-mount package supports space-constrained PCBs that benefit from high integration in a single FPGA device.

Unique Advantages

• High Logic Density:  Approximately 95,000 logic elements allow complex functions and custom accelerators to be implemented on-chip, reducing external component count.
• Substantial On-Chip RAM:  About 5.43 Mbits of embedded memory decreases reliance on external memory, simplifying board design and improving latency for buffering tasks.
• Extensive I/O Capacity:  520 I/O pins provide flexibility for connecting multiple peripherals, sensors, and high-speed interfaces without additional I/O expansion.
• Industrial Temperature Rating:  Specified from −40 °C to 100 °C, supporting deployments in thermally demanding industrial environments.
• Compact BGA Packaging:  1152-BBGA (35×35) surface-mount package supports high-density, space-efficient layouts while maintaining robust electrical connections.
• RoHS Compliant:  Meets RoHS requirements for environmentally conscious manufacturing and global market acceptance.

Why Choose LFE2M100SE-6FN1152I?

The LFE2M100SE-6FN1152I positions itself as a high-density, industrial-grade FPGA option that balances substantial logic resources, embedded memory, and broad I/O capability within a compact BGA footprint. It is well suited for engineers and system designers who need a single-device solution for complex logic, buffering, and high-pin-count I/O in industrial applications.

Backed by Lattice Semiconductor Corporation, this device offers defined electrical and thermal specifications—1.14 V to 1.26 V supply range and −40 °C to 100 °C operation—providing determinism for long-term deployments where known margins and compliance are important.

Request a quote or submit an inquiry to discuss availability, pricing, and how the LFE2M100SE-6FN1152I can fit your next industrial FPGA design.