LFE2M100SE-6FN900I

The LFE2M100SE-6FN900I is an ECP2M family Field Programmable Gate Array (FPGA) device providing high logic density, substantial embedded memory, and a large I/O count in a compact BGA package. It targets designs that require reconfigurable logic, significant on-chip RAM, and industrial-temperature operation.

With 95,000 logic elements, approximately 5.4 Mbits of embedded memory, and 416 available I/O, this device delivers a balance of integration and interface capacity for complex embedded and industrial applications.

Key Features

• Core Logic 95,000 logic elements provide substantial programmable logic capacity for complex designs.
• Embedded Memory Approximately 5.4 Mbits of on-chip RAM for data buffering, look-up tables, and state storage.
• Logic Blocks 11,875 logic blocks (device-reported) to support structured implementation of logic functions.
• High I/O Count 416 I/O pins enable broad external interfacing and connectivity for peripherals and bus interfaces.
• Package 900-BBGA package (900-FPBGA, 31×31) in a surface-mount form factor for high-density board layouts.
• Power Supply Core supply voltage range of 1.14 V to 1.26 V for defined power-domain design.
• Temperature and Grade Industrial-grade device rated for operation from −40 °C to 100 °C for demanding environments.
• RoHS Compliance RoHS-compliant construction to meet environmental regulatory requirements.

Typical Applications

• High-density I/O systems — With 416 I/O pins, suitable for designs requiring numerous external interfaces and parallel connectivity.
• Memory-centric logic — Approximately 5.4 Mbits of embedded memory supports applications that need on-chip storage for buffering and state machines.
• Industrial control and automation — Industrial-grade temperature rating and robust logic capacity make the device appropriate for control systems and embedded industrial instrumentation.
• Compact, high-pin-count platforms — The 900-BBGA (31×31) surface-mount package fits high-density boards where board real estate and pin count are critical.

Unique Advantages

• High logic density: 95,000 logic elements enable implementation of complex logic functions on a single device, reducing the need for multiple components.
• Significant on-chip memory: Approximately 5.4 Mbits of embedded RAM reduces external memory dependency and simplifies board-level design.
• Extensive external connectivity: 416 I/O pins provide flexibility for interfacing with numerous peripherals, buses, and sensors.
• Industrial temperature capability: Rated from −40 °C to 100 °C, supporting deployment in demanding operating environments.
• Compact BGA package: 900-FPBGA (31×31) surface-mount package supports high-density PCB integration while maintaining a large I/O count.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing and procurement.

Why Choose LFE2M100SE-6FN900I?

The LFE2M100SE-6FN900I provides a compelling combination of logic capacity, embedded memory, and I/O count in a compact 900-BBGA footprint. Its industrial-grade temperature rating and RoHS compliance make it suitable for applications that demand reliability and regulatory alignment.

This FPGA is well suited for designers who require a single-device solution to handle complex logic, substantial on-chip RAM, and extensive interfacing in space-constrained, industrial applications.

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