LFE2M20E-5F256C

The LFE2M20E-5F256C is an ECP2M field programmable gate array (FPGA) from Lattice Semiconductor Corporation offered in a 256-ball BGA package. It provides a balance of programmable logic capacity, on-chip memory, and I/O count for commercial-grade applications.

With 19,000 logic elements, approximately 1.25 Mbits of embedded memory, and 140 available I/O, this device targets commercial designs that require moderate logic density in a compact 256-FPBGA (17 × 17) surface-mount package while operating within a 1.14 V to 1.26 V supply range and 0 °C to 85 °C temperature window.

Key Features

• Logic Density  Provides 19,000 logic elements for implementing custom digital logic and state machines.
• Embedded Memory  Approximately 1.25 Mbits of on-chip RAM (1,246,208 bits) to support buffering, lookup tables, and local storage.
• I/O Count  140 I/O pins enable a wide range of peripheral interfaces and board-level connectivity.
• Package  256-ball BGA in a 256-FPBGA (17 × 17) footprint for high pin density in a compact surface-mount form factor.
• Power  Operates from a 1.14 V to 1.26 V supply range to match system power rails and design constraints.
• Mounting  Surface mount package simplifies assembly for modern PCB processes.
• Operating Temperature  Commercial temperature range rated from 0 °C to 85 °C for standard commercial deployments.
• Regulatory  RoHS compliant for lead-free assembly and regulatory alignment in commercial products.

Typical Applications

• Embedded Control Systems  Use the device’s 19,000 logic elements and 140 I/O to implement control logic, state machines, and glue logic in commercial equipment.
• Interface Bridging  Leverage the on-chip memory and I/O count for protocol translation, buffering, and signal aggregation between subsystems.
• Prototyping and Development  Compact 256-FPBGA packaging and moderate logic density make the device suitable for commercial prototype boards and proof-of-concept designs.

Unique Advantages

• Balanced Logic and Memory  Combines 19,000 logic elements with approximately 1.25 Mbits of on-chip RAM to handle both control logic and local data storage without immediate external memory.
• High I/O Capacity  140 I/O pins support multiple peripherals and interfaces, reducing the need for external I/O expanders.
• Compact, High-Density Package  256-FPBGA (17 × 17) footprint delivers high pin count in a space-efficient surface-mount package for dense board designs.
• Low-Voltage Operation  Operation from 1.14 V to 1.26 V aligns with modern low-voltage system rails to simplify power architecture.
• Commercial Grade and RoHS Compliant  Designed for commercial-temperature deployments and compliant with RoHS for lead-free manufacturing.

Why Choose LFE2M20E-5F256C?

The LFE2M20E-5F256C delivers a practical combination of programmable logic, embedded memory, and I/O in a compact 256-BGA package suitable for commercial applications. Its configuration of 19,000 logic elements, approximately 1.25 Mbits of on-chip RAM, and 140 I/O makes it well suited for designers who need moderate density programmable logic with integrated memory in space-constrained boards.

As an option from Lattice Semiconductor Corporation, this device provides a defined commercial temperature range and RoHS compliance, offering a straightforward component choice for projects that require predictable supply voltage operation and compact package integration.

Request a quote or submit a purchase inquiry to receive pricing and availability for the LFE2M20E-5F256C. Our team will respond with next steps for procurement and lead-time information.