LFE2M100SE-7F900C

The LFE2M100SE-7F900C is an ECP2M family field programmable gate array (FPGA) supplied in a 900-BBGA package. It provides a high-density programmable fabric with 95,000 logic elements and approximately 5.4 Mbits of embedded memory to implement custom digital functions.

With 416 I/O and a commercial operating range, this device is suited for a wide range of embedded and communications-focused designs that require on-chip memory, flexible I/O, and compact surface-mount packaging.

Key Features

• Programmable Logic Capacity  95,000 logic elements for implementing complex digital logic and custom architectures.
• Embedded Memory  Approximately 5.4 Mbits of on-chip RAM to support buffering, local data storage, and state machines.
• I/O Resources  416 available I/O pins to interface with peripherals, sensors, and high-density connectors.
• Power Supply Range  Designed for VCC operation between 1.14 V and 1.26 V to match system power rails.
• Package and Mounting  900-BBGA package; supplier device package listed as 900-FPBGA (31x31). Surface-mount mounting type for board-level assembly.
• Operating Temperature  Commercial grade operation from 0°C to 85°C.
• Standards Compliance  RoHS-compliant construction for environmental regulatory alignment.

Typical Applications

• Embedded Systems: Implement glue logic, protocol bridging, and custom control functions where on-chip memory and programmable logic simplify board design.
• Communications & Networking: Use the device’s high I/O count and programmable fabric to handle interface aggregation, packet handling, or protocol adaptation.
• Video & Imaging Processing: Leverage the logic capacity and embedded RAM for buffering, pixel processing pipelines, and timing control.
• Test & Measurement Equipment: Apply the FPGA for real-time signal conditioning, custom data capture, and instrumentation control tasks.

Unique Advantages

• High Integration Density: 95,000 logic elements reduce the need for multiple discrete devices and simplify system architecture.
• Substantial On-Chip Memory: Approximately 5.4 Mbits of embedded RAM supports local data storage and lowers external memory requirements.
• Flexible I/O Count: 416 I/Os allow diverse peripheral interfacing and multi-channel system designs without extensive board-level multiplexing.
• Compact Surface-Mount Package: 900-BBGA (900-FPBGA 31x31) enables dense PCB layouts for space-constrained applications.
• Commercial Temperature Range: Rated 0°C to 85°C to match typical commercial product environments.
• RoHS Compliance: Environmentally compliant design for global product deployment.

Why Choose LFE2M100SE-7F900C?

The LFE2M100SE-7F900C balances high programmable logic capacity, on-chip memory, and abundant I/O in a compact 900-BBGA surface-mount package. Its specifications make it well suited for engineers building embedded systems, communications gear, and advanced processing modules that require a programmable, integrated solution within a commercial temperature range.

Choosing this FPGA supports designs that benefit from reduced external component count, flexible I/O mapping, and significant on-chip memory, offering a scalable platform for development and deployment across a range of commercial applications.

Request a quote or submit an RFQ to receive pricing and availability information for the LFE2M100SE-7F900C.