LFE2M100SE-6FN1152C

The LFE2M100SE-6FN1152C is an ECP2M Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It combines a high logic capacity, substantial on‑chip memory, and a large I/O count in a compact 1152‑ball BGA package for surface‑mount PCB assembly.

Designed for commercial‑grade applications, the device operates from a 1.14 V to 1.26 V supply and across a 0 °C to 85 °C temperature range. It is RoHS compliant and suited to designs that require programmable logic, extensive I/O connectivity, and embedded RAM resources.

Key Features

• Core Logic – 95,000 logic elements provide capacity for complex digital designs and custom logic implementation.
• Embedded Memory – Approximately 5.43 Mbits of on‑chip RAM for data buffering, FIFOs, and intermediate storage.
• I/O Resources – 520 I/O pins to support high‑density interfacing with external devices and peripherals.
• Package & Mounting – 1152‑BBGA (supplier package: 1152‑FPBGA, 35×35 mm) in a surface‑mount form factor for compact system integration.
• Power – Low core voltage operation from 1.14 V to 1.26 V to match tight system power budgets.
• Temperature & Grade – Commercial grade device rated for 0 °C to 85 °C.
• Regulatory – RoHS compliant for environmental and regulatory conformity.

Typical Applications

• High‑density I/O systems – Leverage 520 I/O pins to connect multiple sensors, interfaces, and peripherals on a single FPGA.
• Memory‑buffered data paths – Use approximately 5.43 Mbits of embedded RAM for buffering, packet handling, or data staging in streaming designs.
• Custom logic and acceleration – 95,000 logic elements enable implementation of custom processing pipelines, state machines, and hardware accelerators.
• Compact production boards – Surface‑mount 1152‑BBGA package supports dense board layouts for commercial products.

Unique Advantages

• High logic capacity: 95,000 logic elements give designers room for complex, multi‑function designs without immediate upscaling.
• Substantial embedded memory: Approximately 5.43 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and queuing tasks.
• Extensive I/O count: 520 I/O pins simplify system architecture by accommodating numerous interfaces and peripherals directly.
• Compact high‑density package: 1152‑BBGA (35×35) in a surface‑mount package enables space‑efficient board integration.
• Low core voltage operation: 1.14 V to 1.26 V supply range supports low‑power core domains and aligns with modern power rails.
• Commercial and environmental readiness: Commercial grade temperature range and RoHS compliance support standard production requirements.

Why Choose LFE2M100SE-6FN1152C?

The LFE2M100SE-6FN1152C positions itself as a balanced FPGA option for commercial designs that need a combination of high logic density, significant embedded memory, and a wide complement of I/O in a compact BGA package. Its specification set makes it suitable for system designs where integration density and on‑chip buffering are priorities.

Choose this device when your project requires scalable programmable logic, substantial on‑chip RAM capacity, and large I/O connectivity within a surface‑mount, commercial‑grade component footprint.

Request a quote or submit an inquiry for LFE2M100SE-6FN1152C to receive pricing and availability information.