LFE2M100SE-5FN900C
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 416 5435392 95000 900-BBGA |
|---|---|
| Quantity | 479 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 900-FPBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 900-BBGA | Number of I/O | 416 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11875 | Number of Logic Elements/Cells | 95000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5435392 |
Overview of LFE2M100SE-5FN900C – ECP2M FPGA, 95,000 Logic Elements
The LFE2M100SE-5FN900C is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor configured in a 900-BBGA package. It delivers high logic capacity and substantial on-chip RAM in a surface-mount FPGA targeted at commercial-grade embedded designs.
With 95,000 logic elements, approximately 5.44 Mbits of embedded memory and 416 I/Os, this device is suited to applications that require dense logic, abundant memory resources and a large I/O footprint within a compact BGA package.
Key Features
- Core and Logic Provides 95,000 logic elements for implementing complex digital logic and custom functions.
- Embedded Memory Approximately 5.44 Mbits of on-chip RAM to support buffering, lookup tables and state storage.
- I/O Capacity 416 I/O pins to support extensive peripheral interfacing and system connectivity.
- Power Operates from a specified voltage supply range of 1.14 V to 1.26 V.
- Package & Mounting 900-BBGA (supplier package: 900-FPBGA, 31 × 31 mm) in a surface-mount form factor for PCB assembly.
- Temperature & Grade Commercial grade device rated for 0 °C to 85 °C operating temperature.
- Environmental Compliance RoHS compliant.
Unique Advantages
- High logic density: 95,000 logic elements provide capacity for large-scale and multi-function designs without immediate migration to larger devices.
- Substantial on-chip memory: Approximately 5.44 Mbits of embedded RAM reduces the need for external memory in many buffering and lookup applications.
- Extensive I/O count: 416 I/Os enable broad peripheral support and flexible board-level connectivity options.
- Compact BGA packaging: 900-BBGA (31 × 31 mm) balances high pin count with a compact footprint suitable for dense PCB layouts.
- Commercial temperature rating: Designed for standard commercial environments with an operating range of 0 °C to 85 °C.
- RoHS compliant: Meets common environmental compliance expectations for commercial electronics production.
Why Choose LFE2M100SE-5FN900C?
The LFE2M100SE-5FN900C positions itself as a high-capacity, commercially graded FPGA option that combines extensive logic resources, multi-megabit on-chip RAM and a large I/O complement in a 900-BBGA surface-mount package. Its specified voltage range and operating temperature make it suitable for mainstream embedded designs where integration density and I/O flexibility are priorities.
This device is well suited for engineering teams and procurement sourcing FPGA silicon for scalable prototypes or production designs that benefit from high logic element counts, significant embedded memory, and a compact, high-pin-count package backed by RoHS compliance.
If you would like pricing, availability or to request a quote for the LFE2M100SE-5FN900C, submit a sales inquiry or request a quote today.
