LFE2M100SE-6F900I

The LFE2M100SE-6F900I is an ECP2M family Field Programmable Gate Array (FPGA) offering high-density logic and on-chip memory in a compact ball grid array package. With 95,000 logic elements, approximately 5.44 Mbits of embedded memory and 416 I/O pins, it targets industrial designs that require substantial programmable logic, moderate embedded RAM, and a large I/O count.

Designed for surface-mount assembly and rated for industrial temperature operation, this device delivers a combination of integration, I/O capacity, and industrial-grade temperature range for robust embedded and control applications.

Key Features

• Core Logic  95,000 logic elements provide broad programmable logic capacity for complex digital functions.
• Embedded Memory  Approximately 5.44 Mbits of on-chip RAM for buffering, packet storage, and state machine implementation.
• I/O Capacity  416 user I/O pins to support parallel interfaces, bus connectivity, and multiple peripheral connections.
• Power Supply  Operates from a supply range of 1.14 V to 1.26 V, enabling integration into low-voltage system rails.
• Package and Mounting  900-ball BGA package (supplier device package: 900-FPBGA (31x31)) optimized for surface-mount PCB assembly.
• Industrial Temperature Range  Qualified for operation from −40 °C to 100 °C for deployment in industrial environments.
• Regulatory Compliance  RoHS compliant material status for lead-free and environmentally conscious designs.

Unique Advantages

• High logic density: 95,000 logic elements support complex control, signal processing, and glue-logic consolidation, reducing the need for multiple discrete ICs.
• Substantial on-chip RAM: Approximately 5.44 Mbits of embedded memory enable local buffering and state storage without external RAM.
• Extensive I/O headroom: 416 I/O pins simplify integration with peripherals, sensors, and parallel interfaces, lowering board-level routing complexity.
• Industrial-rated operation: −40 °C to 100 °C temperature rating supports deployment in demanding environmental conditions.
• Compact, manufacturable package: 900-BBGA (900-FPBGA (31x31)) supports high-density PCB layouts while using standard surface-mount assembly processes.
• RoHS compliance: Conforms to lead-free requirements for environmentally focused product builds.

Why Choose LFE2M100SE-6F900I?

The LFE2M100SE-6F900I positions itself as a high-capacity, industrial-grade FPGA option for designs that require significant programmable logic, embedded memory, and large I/O counts in a compact surface-mount BGA package. Its voltage and temperature specifications align with low-voltage systems and industrial environments, making it suitable for long-term deployments where environmental tolerance and integration density matter.

This device is well suited to engineering teams and procurement for mid-to-high complexity embedded applications that benefit from on-chip memory, abundant I/O, and the integration advantages of a single FPGA device.

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