LFE2M100SE-6F900C

The LFE2M100SE-6F900C is an ECP2M Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a high-density programmable logic platform with 95,000 logic elements, approximately 5.435 Mbits of embedded RAM, and 416 user I/Os in a 900‑BBGA package.

Designed for commercial-grade applications, this surface-mount FPGA targets system designs that require substantial logic capacity, significant on-chip memory, and a large I/O count while operating within a 1.14 V to 1.26 V supply range and a 0 °C to 85 °C temperature window.

Key Features

• Core Logic: 95,000 logic elements providing substantial programmable logic capacity for complex control, data-path, and glue‑logic functions.
• Embedded Memory: Approximately 5.435 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory dependence.
• I/O Capacity: 416 user I/Os to accommodate wide parallel interfaces, multiple peripherals, and high-pin-count connectivity requirements.
• Power Supply: Operates from a 1.14 V to 1.26 V supply range, allowing precise power-domain integration in modern system designs.
• Package & Mounting: 900‑BBGA (supplier device package: 900‑FPBGA, 31 × 31) in a surface-mount form factor for compact board-level integration.
• Commercial Grade & Temperature Range: Rated for commercial operation with an ambient range of 0 °C to 85 °C.
• Environmental Compliance: RoHS compliant, supporting lead‑free assembly and regulatory alignment for many commercial products.

Typical Applications

• I/O‑intensive interface bridging: The 416 I/Os are well suited for designs that require wide parallel interfaces, protocol bridging, or multiple peripheral connections.
• On‑chip buffering and data staging: Approximately 5.435 Mbits of embedded RAM enables local storage for packet buffering, FIFOs, or temporary data retention without external memory.
• High‑density programmable logic: With 95,000 logic elements, the device supports complex control logic, custom datapaths, and glue logic in compact commercial systems.

Unique Advantages

• High logic density: 95,000 logic elements provide the capacity to consolidate multiple discrete functions into a single programmable device, reducing BOM count.
• Generous embedded memory: Approximately 5.435 Mbits of on‑chip RAM reduces dependence on external memory, simplifying board layout and lowering system latency.
• Extensive I/O resources: 416 user I/Os enable flexible interfacing and support for parallel buses, sensors, and multiple peripherals without external expanders.
• Compact, assembly‑friendly package: 900‑BBGA (31 × 31 FPBGA) offers high pin density in a surface-mount footprint for space-constrained designs.
• Commercial-grade operation: Rated for 0 °C to 85 °C, matching many commercial product requirements while maintaining predictable performance across the specified range.
• RoHS compliant: Meets environmental requirements for lead‑free assembly in commercial products.

Why Choose LFE2M100SE-6F900C?

The LFE2M100SE-6F900C positions itself as a high‑capacity, commercially graded FPGA solution for system designers who need a balance of significant logic resources, substantial on‑chip memory, and a large number of I/Os in a compact surface‑mount package. Its supply and temperature specifications make it suitable for a wide range of commercial embedded designs.

From consolidating multiple functions to reducing external memory and I/O components, this FPGA provides a scalable platform for designs that prioritize integration and board‑level efficiency while remaining aligned with RoHS environmental requirements.

Request a quote or submit a procurement inquiry to evaluate the LFE2M100SE-6F900C for your next commercial FPGA design.