LFE2M100SE-6FN900C

The LFE2M100SE-6FN900C is an ECP2M Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It delivers a mid-range combination of programmable logic, on-chip memory, and a high I/O count in a compact 900‑ball BGA package.

With 95,000 logic elements, approximately 5.4 Mbits of embedded RAM and up to 416 I/Os, this device is suited for designs that require substantial logic density, on-chip buffering, and extensive peripheral connectivity within commercial temperature ranges.

Key Features

• Core Logic  95,000 logic elements provide substantial programmable capacity for complex combinational and sequential logic implementations.
• Embedded Memory  Approximately 5.4 Mbits of on‑chip RAM for buffering, FIFOs, and local storage to support data‑intensive logic functions.
• I/O Density  Up to 416 general-purpose I/Os to support multiple interfaces, parallel buses, and extensive external device connections.
• Package  900‑BBGA package (supplier package: 900‑FPBGA, 31×31 mm) for high pin‑count integration in space‑conscious board designs.
• Power  Core supply voltage range of 1.14 V to 1.26 V to match low‑voltage system domains and optimize power delivery.
• Mounting & Compliance  Surface mount device with RoHS compliance for modern manufacturing and environmental standards.
• Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C operation.

Typical Applications

• Communications Equipment  High I/O count and embedded memory enable protocol bridging, packet buffering, and custom interface logic.
• Industrial Control  Programmable logic capacity supports complex control algorithms, real‑time decision logic, and multiple sensor or actuator interfaces.
• Measurement & Instrumentation  On‑chip RAM and abundant I/Os facilitate data acquisition, buffering, and parallel sensor interfacing.
• Embedded Systems  A dense logic fabric and significant embedded memory allow consolidation of custom peripherals and glue logic into a single device.

Unique Advantages

• High Logic Density: 95,000 logic elements reduce the need for multiple devices, simplifying board design and lowering BOM complexity.
• Significant On‑Chip Memory: Approximately 5.4 Mbits of embedded RAM supports buffering and local data processing without external memory.
• Extensive I/O Count: 416 I/Os provide flexibility to connect many peripherals or implement parallel interfaces without external multiplexing.
• Compact High‑Pin Package: 900‑BBGA (31×31 mm) enables high pin density in a space‑efficient footprint for compact systems.
• Low‑Voltage Core: 1.14–1.26 V supply range aligns with contemporary low‑voltage system domains to help optimize power delivery.
• RoHS Compliant: Meets environmental compliance expectations for commercial manufacturing.

Why Choose LFE2M100SE-6FN900C?

The LFE2M100SE-6FN900C positions itself as a capable mid‑range FPGA offering a blend of substantial logic capacity, meaningful embedded RAM, and a very high I/O count in a compact 900‑ball BGA package. It is well suited for designers seeking to consolidate custom logic, buffering, and interface functions into a single, surface‑mount device across commercial temperature conditions.

Manufactured by Lattice Semiconductor Corporation, this FPGA is appropriate for teams building communications, industrial control, instrumentation, and embedded systems that require a scalable, integrated logic solution with clear electrical and mechanical characteristics.

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