LFE2M100SE-5FN1152C

The LFE2M100SE-5FN1152C is a Lattice ECP2M family FPGA optimized for high-density programmable logic and system integration. It combines a large logic fabric, abundant I/O, and embedded memory to support communication, signal processing and embedded control applications where integration and flexibility are required.

With 95,000 logic elements, approximately 5.44 Mbits of embedded memory and 520 I/Os in a 1152-ball BGA package, this surface-mount device targets designs that need significant on-chip resources and flexible I/O while operating from a 1.14 V to 1.26 V supply within a commercial 0 °C to 85 °C temperature range.

Key Features

• Logic Capacity — 95,000 logic elements to implement large FPGA designs and complex custom logic.
• On-chip Memory — Approximately 5.44 Mbits of embedded RAM for buffering, packet storage and local data scratchpads.
• High I/O Count — 520 programmable I/Os for dense peripheral, memory and high-pin-count interface requirements.
• High-speed SERDES (Family Capability) — LatticeECP2M family supports embedded SERDES with data rates from 250 Mbps to 3.125 Gbps and up to 16 channels per device for high-speed serial links and multi-protocol communications.
• DSP and Compute Blocks (Family Capability) — Enhanced sysDSP blocks in the family provide dedicated multiply-accumulate resources for signal processing workloads.
• Flexible Clocking (Family Capability) — Multiple PLLs and DLLs in the family enable clock multiply/divide, phase and delay adjustments for complex clocking networks.
• Programmable I/O Standards (Family Capability) — Supports a wide range of interfaces and standards across device I/O banks to match system signaling requirements.
• Package and Mounting — 1152-ball BGA (supplier package: 1152-FPBGA, 35 × 35 mm) optimized for surface-mount assembly in space-constrained boards.
• Power and Temperature — Operates from a 1.14 V to 1.26 V supply and rated for commercial operation from 0 °C to 85 °C.
• RoHS Compliant — Conforms to RoHS requirements for lead-free assembly.

Typical Applications

• Telecommunications and Networking — On-chip SERDES and high I/O counts support multi-protocol interfaces, backplane and board-level link implementations.
• Signal Processing — Large logic capacity and the family’s sysDSP resources enable filtering, encoding/decoding and other DSP tasks.
• Embedded System Integration — High memory capacity and abundant I/Os make the device suitable as a central programmable hub for feature-rich embedded platforms.
• High-density Interface Bridging — Use as protocol bridges, I/O expanders or interface concentrators where many parallel and serial interfaces must be aggregated.

Unique Advantages

• Substantial Logic and Memory on a Single Device: 95,000 logic elements and approximately 5.44 Mbits of embedded RAM reduce external memory and glue-logic requirements.
• Large, Flexible I/O Count: 520 I/Os provide the pin budget needed for complex multi-interface boards and dense peripheral connections.
• Family-Level High-speed SerDes: Supports high-speed serial lanes (250 Mbps to 3.125 Gbps) for scalable communications and protocol support.
• Commercial Temperature and Standard Supply: 0 °C to 85 °C rating and 1.14 V–1.26 V supply support mainstream embedded and networking products.
• RoHS-Compliant, Surface Mount Package: 1152-ball BGA in a 35 × 35 mm footprint for modern assembly flows and reduced PCB area.
• Design Ecosystem (Family): The ECP2/M family includes design tools and on-chip capabilities that assist development and debug of complex designs.

Why Choose LFE2M100SE-5FN1152C?

The LFE2M100SE-5FN1152C offers a balance of high logic density, substantial embedded memory and a large I/O complement in a compact BGA package, making it well suited to communications, signal processing and integrated embedded designs that require on-chip resources to reduce BOM and board complexity. Its operating voltage and commercial temperature range match typical embedded and networking product requirements.

As part of the Lattice ECP2/M family, this device benefits from family-level features for high-speed serial links, DSP acceleration and flexible clocking, providing scalability and ecosystem support for development across similar device sizes and capabilities.

Request a quote or submit an inquiry to get pricing and availability for the LFE2M100SE-5FN1152C and to discuss how it fits your next design.