LFE2M100E-7FN1152C

The LFE2M100E-7FN1152C is an ECP2M family Field Programmable Gate Array (FPGA) provided in a 1152-BBGA package. It delivers 95,000 logic elements, approximately 5.44 Mbits of embedded memory and 520 I/O pins in a surface-mount, 1152-FPBGA (35×35) footprint.

Designed for commercial-temperature applications, this device operates from a 1.14 V to 1.26 V supply and is RoHS compliant, offering a compact, high-density programmable fabric for designs requiring substantial logic, memory and I/O integration.

Key Features

• Logic Capacity  95,000 logic elements provide substantial programmable logic resources for complex designs.
• Embedded Memory  Approximately 5.44 Mbits (5,435,392 bits) of on-chip RAM to support buffering, state storage and data processing functions.
• I/O Count  520 general-purpose I/O pins enable extensive interfacing to peripherals, sensors and external memory devices.
• Package  1152-BBGA / 1152-FPBGA (35×35) surface-mount package for high-density board integration.
• Power  Core supply range of 1.14 V to 1.26 V for the device core voltage domain.
• Operating Temperature  Commercial-grade rating with an operating range of 0 °C to 85 °C.
• Compliance  RoHS compliant, supporting lead-free manufacturing requirements.

Typical Applications

• High-density I/O systems  With 520 I/O pins, the device is well suited to applications that require extensive external interfacing and parallel connectivity.
• Memory-intensive designs  Approximately 5.44 Mbits of embedded RAM supports on-chip buffering and local data storage needs.
• Complex programmable logic  95,000 logic elements enable implementation of large-scale digital logic functions and custom datapaths.

Unique Advantages

• High logic integration: 95,000 logic elements reduce the need for multiple discrete devices by consolidating complex logic into a single FPGA.
• Substantial on-chip memory: Approximately 5.44 Mbits of embedded RAM minimizes external memory dependence and improves data throughput for localized processing.
• Extensive I/O capability: 520 I/Os provide flexibility for dense peripheral, sensor and bus interfacing without external multiplexers.
• Compact high-pin-count package: The 1152-BBGA (35×35) package enables a high I/O and resource count in a space-efficient form factor.
• Commercial-grade operation: Rated for 0 °C to 85 °C, suitable for standard commercial environments and applications.
• RoHS compliant: Supports modern, lead-free manufacturing processes and regulatory requirements.

Why Choose LFE2M100E-7FN1152C?

This FPGA combines a large logic element count, significant embedded memory and a very high I/O pin count in a compact 1152-BBGA package, making it a strong choice for designs that require consolidated digital logic, on-chip data storage and broad external interfacing. Its commercial temperature rating and RoHS compliance make it appropriate for mainstream electronic products and development projects.

Choose the LFE2M100E-7FN1152C when your design targets demand extensive programmable logic, embedded RAM and numerous I/Os within a single, surface-mount FPGA package.

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