LFE2M100E-6FN900C

The LFE2M100E-6FN900C is an ECP2M family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It delivers a high-density, commercial-grade programmable logic fabric with extensive I/O and embedded memory for designs that require significant on-chip logic and interface capacity.

With 95,000 logic elements and approximately 5.44 Mbits of on-chip RAM, this device targets applications that need consolidation of logic, memory, and I/O in a compact 900-ball BGA package while operating within a commercial temperature range.

Key Features

• Core Logic  95,000 logic elements provide a high level of programmable logic capacity for complex functions and custom data paths.
• Embedded Memory  Approximately 5.44 Mbits of on-chip RAM to support buffering, look-up tables, and local data storage without external memory in many designs.
• I/O Density  416 I/O pins enable multiple interfaces and high pin-count connectivity for board-level integration and system interfacing.
• Power Supply  Operates from a supply range of 1.14 V to 1.26 V, allowing designs to target the device's specified core voltage domain.
• Package and Mounting  Available in a 900-ball BGA (Supplier Device Package: 900-FPBGA, 31 × 31); surface-mount mounting type for compact board integration.
• Operating Range & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C for standard commercial applications.
• Regulatory Compliance  RoHS compliant to meet current lead-free and environmental requirements.

Typical Applications

• I/O-Intensive Systems  Use the 416 I/O pins to consolidate multiple peripheral interfaces and bridge logic between subsystems.
• Custom Logic and Acceleration  Leverage 95,000 logic elements to implement custom compute blocks, protocol handlers, or control logic.
• On-Chip Data Storage  Approximately 5.44 Mbits of embedded memory supports buffering, look-up tables, and local data processing needs.
• Compact Board Designs  The 900-ball BGA, surface-mount package enables high-density placement for space-constrained PCBs.

Unique Advantages

• High Logic Capacity: 95,000 logic elements allow significant consolidation of logic functions onto a single FPGA, reducing the need for multiple discrete devices.
• Substantial On-Chip Memory: Approximately 5.44 Mbits of embedded RAM provides local storage for buffering and state, simplifying external memory requirements.
• Extensive I/O: 416 I/O pins support dense connectivity for peripherals, sensors, and multi-channel interfaces.
• Compact BGA Package: The 900-ball FPBGA (31 × 31) package delivers high pin count in a compact footprint suitable for tight board layouts.
• Commercial Readiness: Commercial grade and RoHS compliance make the device appropriate for mainstream electronics and production environments.

Why Choose LFE2M100E-6FN900C?

The LFE2M100E-6FN900C positions itself as a high-density, commercially graded FPGA option within the ECP2M family from Lattice Semiconductor Corporation. Its combination of 95,000 logic elements, approximately 5.44 Mbits of embedded memory, and 416 I/O pins provides a balanced platform for designs that require substantial on-chip resources and connectivity in a compact BGA package.

This device is well suited for engineers planning to consolidate logic and memory-heavy functions onto a single programmable device while maintaining a commercial temperature profile. Backed by Lattice Semiconductor Corporation, it offers a clear specification set for procurement and system integration.

Request a quote or submit an inquiry for LFE2M100E-6FN900C to discuss availability, pricing, and lead times for your next design.