LFE2M100E-6FN900I

The LFE2M100E-6FN900I is an ECP2M family field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation designed for industrial applications. It integrates a high density of logic resources, on-chip embedded memory and a large I/O count in a compact 900-BBGA package for board-level designs that require significant programmable logic and I/O connectivity.

With 95,000 logic elements, approximately 5.4 Mbits of embedded memory and 416 I/O pins, this device targets designs that need dense logic, substantial local memory and extensive external interfacing while operating over an industrial temperature range.

Key Features

• Logic Capacity — 95,000 logic elements provide programmable resources for glue logic, custom processing, and complex state machines.
• Embedded Memory — Approximately 5.4 Mbits of on-chip RAM to support buffering, lookup tables and local data storage without external memory.
• I/O Density — 416 user I/O pins enable wide external connectivity for sensors, interfaces and parallel buses.
• Package — 900-BBGA package (supplier device package: 900-FPBGA, 31×31) offers a high-pin-count, compact footprint for board-level integration.
• Power — Core supply range of 1.14 V to 1.26 V to match system power rails and design constraints.
• Thermal and Environmental — Industrial-grade operating temperature from −40 °C to 100 °C for use in extended-temperature environments.
• Mounting and Compliance — Surface-mount package and RoHS-compliant status for modern assembly and regulatory requirements.

Typical Applications

• Industrial Control — Programmable logic and wide temperature range make the device suitable for motor control, PLC I/O expansion and factory automation systems.
• High-Density I/O Systems — 416 I/O pins support designs that require many external signals such as multi-channel data acquisition and interface bridging.
• Memory-Intensive Logic — Approximately 5.4 Mbits of embedded memory is useful for buffering, LUTs and local data storage in streaming or packet processing tasks.
• Compact, High-Pin-Count Boards — The 900-BBGA footprint provides high connectivity in space-constrained PCBs for embedded and board-level products.

Unique Advantages

• High Logic Density: 95,000 logic elements enable implementation of complex logic and integration of multiple functions on a single device, reducing system BOM.
• Substantial On-Chip Memory: Approximately 5.4 Mbits of embedded RAM lowers dependence on external memory, improving performance and simplifying board layout.
• Extensive I/O Count: 416 I/O pins accommodate broad interfacing needs without additional multiplexing or external I/O expanders.
• Industrial-Grade Operation: Qualified for −40 °C to 100 °C operation to support deployments in extended-temperature environments.
• Compact High-Pin Package: 900-BBGA (900-FPBGA, 31×31) balances high pin count with a small PCB footprint for dense system designs.
• RoHS Compliant: Conforms to RoHS for use in contemporary manufacturing and assembly processes.

Why Choose LFE2M100E-6FN900I?

The LFE2M100E-6FN900I positions itself as a high-capacity, industrial-grade FPGA option for designers who need large programmable logic, significant embedded memory and a high I/O count in a compact package. Its combination of 95,000 logic elements, approximately 5.4 Mbits of on-chip RAM and 416 I/Os makes it suitable for complex control, interface and data-processing tasks on constrained PCBs.

Backed by Lattice Semiconductor Corporation, this ECP2M family device offers a balance of integration, thermal range and packaging that supports long-term deployment in industrial and board-level systems where space, I/O and local memory are key design drivers.

Request a quote or submit a purchase inquiry today to evaluate the LFE2M100E-6FN900I for your next industrial FPGA design.