LFE2M100E-6FN1152C

The LFE2M100E-6FN1152C is an ECP2M family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for commercial electronic applications. It provides a high logic density architecture with extensive I/O and embedded memory to implement complex digital functions, interface bridging, and custom control logic.

With 95,000 logic elements, approximately 5.4 Mbits of embedded memory, and 520 I/O pins in a compact 1152-BBGA package, this surface-mount FPGA targets designs that require significant integration while operating within standard commercial temperature and supply ranges.

Key Features

• Core Logic  95,000 logic elements for implementing complex, high-density digital logic and custom processing blocks.
• Embedded Memory  Approximately 5.4 Mbits of on-chip RAM to support buffering, packet storage, and local data processing without external memory.
• I/O Capacity  520 general-purpose I/O pins to support high-pin-count interfaces and multiple parallel or serial connections.
• Power  Core voltage supply range of 1.14 V to 1.26 V for compatibility with targeted power domains.
• Package & Mounting  1152-BBGA (supplier package 1152-FPBGA, 35 × 35 mm) in a surface-mount configuration for compact PCB integration.
• Operating Range & Grade  Commercial-grade operation from 0 °C to 85 °C, suitable for standard industrial and consumer applications.
• Environmental Compliance  RoHS compliant, meeting common environmental requirements for modern electronic manufacturing.

Typical Applications

• High-density interface bridging  Use the 520 I/O pins to implement protocol translation and multi-channel data routing in communication equipment and test systems.
• Embedded control and signal processing  Leverage 95,000 logic elements and on-chip RAM to implement custom control loops, DSP pipelines, and deterministic logic functions.
• Data buffering and packet handling  Approximately 5.4 Mbits of embedded memory supports packet buffering, frame staging, and FIFO-based data management for networking and media applications.
• Compact system integration  The 1152-BBGA surface-mount package enables dense PCB designs where board space and I/O counts are critical.

Unique Advantages

• High integration density: 95,000 logic elements combined with substantial embedded memory reduce the need for external logic and memory components.
• Extensive I/O resource pool: 520 I/Os provide flexibility for implementing multiple interfaces, parallel buses, or mixed-signal front-ends.
• Compact BGA footprint: 1152-BBGA (35 × 35 mm) package supports high-pin-count designs while minimizing PCB area.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match standard consumer and many industrial electronics environments.
• Regulatory alignment: RoHS compliance supports environmentally conscious production and global supply requirements.
• Controlled core supply range: Specified 1.14 V to 1.26 V core voltage simplifies power sequencing and domain planning in multi-voltage systems.

Why Choose LFE2M100E-6FN1152C?

The LFE2M100E-6FN1152C positions itself as a high-density, commercially graded FPGA option for designers needing substantial logic capacity, on-chip memory, and a large I/O count in a compact BGA package. Its combination of 95,000 logic elements, approximately 5.4 Mbits of embedded memory, and 520 I/Os makes it suitable for applications requiring consolidation of multiple functions and interfaces onto a single programmable device.

Manufactured by Lattice Semiconductor Corporation and provided in a RoHS-compliant, surface-mount 1152-BBGA package, this device is a practical choice for teams building commercial systems that prioritize integration density, predictable operating ranges, and established vendor documentation.

Request a quote or submit an inquiry to purchase the LFE2M100E-6FN1152C and include your required quantity and delivery timeframe to receive pricing and availability information.