LFE2M100E-5FN900I

The LFE2M100E-5FN900I is an ECP2M family Field Programmable Gate Array (FPGA) in a 900-BBGA package designed for industrial applications. It delivers high logic density and substantial on-chip memory, along with a large I/O count and a compact surface-mount footprint.

This device targets designs that require up to 95,000 logic elements and approximately 5.4 Mbits of embedded memory while operating across an industrial temperature range and a low-voltage supply domain.

Key Features

• Core Logic  Provides 95,000 logic elements (based on device logic element count) for implementing complex digital functions.
• Embedded Memory  Approximately 5.4 Mbits of on-chip RAM (total RAM bits: 5,435,392) to support large buffering, state machines, and data storage.
• I/O Capacity  Up to 416 I/O pins to support extensive peripheral connectivity and high-pin-count interfaces.
• Voltage Supply  Operates from 1.14 V to 1.26 V, suitable for designs with low-voltage core requirements.
• Package & Mounting  900-BBGA footprint (supplier device package: 900-FPBGA, 31 × 31 mm) in a surface-mount form factor for compact board integration.
• Operating Range  Industrial-grade operation from −40 °C to 100 °C for use in thermally demanding environments.
• Regulatory  RoHS compliant, supporting regulatory requirements for lead-free assembly.
• Logic Resource Breakdown  Includes 11,875 LABs/CLBs (logic array blocks) to structure and organize digital logic resources efficiently.

Typical Applications

• Industrial Control Systems  High logic density and industrial temperature rating make this FPGA suitable for control and automation equipment requiring reliable operation across a wide thermal range.
• High‑I/O Embedded Systems  With 416 I/O pins, the device supports designs that require extensive sensor, actuator, or peripheral interfacing.
• Data Buffering and Processing  Approximately 5.4 Mbits of on-chip RAM enable buffering, packet handling, and intermediate data storage in streaming or processing applications.
• Compact Board Designs  The 900-BBGA, surface-mount package allows designers to integrate high-capacity FPGA functionality into space-constrained PCBs.

Unique Advantages

• Highly integrated logic and memory: Combines 95,000 logic elements with approximately 5.4 Mbits of embedded memory to reduce external component count and simplify system architecture.
• Large I/O compliment: 416 I/O pins support complex interfacing and reduce the need for external multiplexing or expanders.
• Industrial temperature capability: Rated from −40 °C to 100 °C to meet the thermal demands of industrial deployments.
• Compact, board-friendly package: 900-BBGA (31 × 31 mm) surface-mount package enables high-density integration without sacrificing performance.
• Low-voltage core operation: 1.14 V to 1.26 V supply range helps optimize power delivery for modern low-voltage system rails.
• RoHS compliant: Supports lead-free assembly and environmental compliance requirements.

Why Choose LFE2M100E-5FN900I?

The LFE2M100E-5FN900I positions itself as a high-density, industrial-grade FPGA option that balances substantial logic and memory resources with a large I/O count and compact package. Its electrical and thermal specifications make it appropriate for embedded and industrial designs that demand reliability, high integration, and significant on-chip resources.

This device is well suited for engineers and procurement teams building systems that require scalability of logic resources, ample embedded RAM, and robust operation across a wide temperature range while maintaining a compact board footprint.

Request a quote or submit an inquiry to learn more about pricing, availability, and how LFE2M100E-5FN900I can fit into your next design.